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Revasum and Asahi Diamond America join forces on SiC


Companies announce aim to improve SiC wafer grinding

Semiconductor equipment firm Revasum and Asahi Diamond America, a provider of diamond and cubic boron nitride tools, have announce a strategic collaboration aimed at enhancing SiC wafer grinding.

The collaboration centres around the use of Revasum's 7AF-HMG SiC grinder (pictured above), designed for 150mm and 200mm SiC wafers, and Asahi Diamond America's abrasive technology.

The 7AF-HMG is distinguished by its hard material optimised grind engine that quickly and precisely thins and planarises SiC wafers. Its advanced features and precision are said to make it a game changer, ensuring efficient and productive processing of bare substrates and device wafers at customer facilities.

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