Sivers and WIN collaborate on DFB laser production
Sivers Semiconductors has announced a partnership with WIN Semiconductor to enhance production of Sivers' proprietary high-power DFB lasers and laser arrays technology.
This collaboration paves the way for high-volume manufacturing of critical components for coarse wavelength division multiplexing (CWDM) and dense wavelength division multiplexing (DWDM) applications.
WIN Semiconductors will serve as an outsourced manufacturing partner for Sivers Semiconductors, enabling the company to scale production and meet the growing demand for its cutting-edge photonic solutions.
Sivers says this combination of WIN Semiconductor’s expertise in compound semiconductor manufacturing with Sivers' advanced laser chip technology, marks a significant milestone, .
“This partnership is a crucial step in our strategy to scale our manufacturing capabilities and ensure our customers receive high-quality, high-performance photonic solutions with greater efficiency and reliability,” said Vickram Vathulya, CEO of Sivers Semiconductors. “By partnering with WIN Semiconductor, we are enhancing our production capabilities and accelerating time-to-market for our customers, supporting applications such as next-generation optical interconnects, silicon photonics, and optical I/O for co-packaged optics (CPO).”
“We’re excited to work alongside the Sivers team to bring their advanced DFB lasers and arrays to high-volume production,” said William Chang, GM of WIN Semiconductors. “This collaboration combines our manufacturing expertise with Sivers’ innovation to drive next-level performance in CWDM and DWDM applications.”
