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VisIC, Heraeus and PINK collaborate on GaN EV module

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GaN power module is based on a silicon nitride substrate, silver sintering and advanced top side interconnect

GaN company VisIC Technologies has partnered with materials company Heraeus Electronics, and sintering equipment firm PINK to develop an advanced power module using D3GaN technology.

This combination of VisIC's D3GaN technology with Heraeus' sintering paste and PINK's Ag and Cu sintering process and sintering equipment is claimed to set a new benchmark for power module performance in the EV market. The partners expect it to drive the adoption of GaN technology in this field.

The module is based on a silicon nitride (Si₃N₄) ceramic substrate, an innovative silver (Ag) sintering process and advanced top side interconnect to deliver high reliability and performance for battery electric vehicles (BEVs).

The use of a Si₃N₄ metal ceramic substrate is a key innovation. Si₃N₄ is known for its high thermal conductivity, mechanical strength, and reliability under high-temperature conditions.

The adoption of the silver sintering process by PINK enhances the thermal and electrical conductivity of the module. Silver sintering is a low-temperature bonding process that creates robust and reliable connections between components, improving the module's overall durability and efficiency. This process is said to be critical for the high reliability required in EV powertrains, where consistent performance is non-negotiable.

The resulting power module is designed to meet the stringent reliability and performance standards of the electric vehicle industry. It can deliver the high-power density of over 500Arms/650V and efficiency needed for modern BEVs, while also offering long-term reliability and durability at a cost point near silicon devices.

Tamara Baksht, CEO of VisIC, state: “We are thrilled to work with the leading manufacturer of sintering processes of Heraeus Electronics and PINK and adapt their experience into GaN based power modules to develop the next generation of power module for high volume automotive inverter applications.”

Andrea Pink, CEO of PINK statement: “We are excited to work with such a future driven company as VisIC together with our long-term partner Heraeus Electronics, supporting the newest product innovation for GaN applications.”

Heraeus Electronics Michael Jörger, EVP Head of Business Line Power Electronic Materials added: “With our materials, application know-how and engineering services we are glad to work with our partners on speeding up the innovative approach of highly efficient GaN modules for automotive applications.”

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