ClassOne expands Solstice single-wafer portfolio
ClassOne Technology, a provider of electroplating and wet processing tools, has launched Solstice Max, its new, modular 300mm single-wafer platform.
“Solstice Max provides a turnkey solution for electroplating, wet processing, solvent strip, and wafer cleans, delivering superior performance and throughput without unnecessary complexity,” said ClassOne Technology CEO Byron Exarcos.
“The result is industry-leading ROI and cost of ownership for key applications in advanced packaging, seed and barrier etch, solvent processing, back-end cleans, advanced gold plating, and emerging technologies.”
Purpose-built for a broad range of wafer-level packaging (WLP) applications, Solstice Max supports silicon, glass, thinned, and bonded wafers, with up to 16 process chambers for electrochemical deposition (ECD), solvent, and etch applications.
The platform’s modular design is field-extendible — customers can start with a four-chamber base and expand to 16 chambers as production escalates.
ClassOne says it has already received orders for Solstice Max from multiple top-tier customers. Delivery is expected to begin in early 2026.
