Photon Bridge & PHIX advance DWDM laser sources for AI data centres
Collaboration combines Photon Bridge's photonic integration expertise with PHIX's advanced packaging capabilities to accelerate volume production for CPOs and high-density interconnect applications.
Bridge and PHIX have announced their partnership to advance Photon Bridge's high-performance DWDM external laser source Transmit Optical Sub-Assembly (TOSA), targeting co-packaged optics (CPO) and high-density optical interconnects for AI data center infrastructure.
Photon Bridge drives end-to-end product development, spanning multi-wavelength external laser source design, photonic integration platform, packaging architecture, and thermal simulation, underpinned by deep in-house expertise across the optical module stack.
PHIX, a highly specialized photonic packaging house with an established track record of taking advanced designs from prototype through to volume production, brings complementary capabilities that support Photon Bridge's path from advanced design to a deployment-ready module. PHIX's model, that bridges early-stage development to high-volume manufacturing, provides a well-defined and proven route to scale for Photon Bridge's TOSA.
The collaboration reflects a shared commitment to developing a sustained working relationship within the Dutch photonics ecosystem, and to accelerating the availability of high-performance optical engines for next-generation AI infrastructure.
"Photon Bridge is building a true product company, spanning from the photonic chip to the fully integrated module,” said John Anderton, CCO of Photon Bridge. “The market needs a packaged, deployment-ready external laser source, and that is exactly what we are delivering. PHIX's expertise and their model of developing packages to manufacturing readiness before transferring to volume production gives us a clear and reliable path to scale. Collaborating with world-class partners in our local ecosystem is central to how we operate."
“We are pleased to partner with Photon Bridge on their TOSA development,” said Jeroen Duis, CTO of PHIX. “Their full-stack photonic integration approach aligns strongly with the demands of CPO and AI interconnects. At PHIX, we enable innovative photonics companies to transition efficiently from advanced design to volume packaging, and we look forward to doing exactly that together.”
