QuantumDiamonds deploys tool at Taiwanese test house
QuantumDiamonds GmbH, the Munich-based pioneer in quantum sensing-based semiconductor testing, has anounced the successful deployment of its QDm.1 system at Integrated Service Technology (iST) in Hsinchu, Taiwan.
Following the company’s expansion into Asia in March and successful installation of the system in the US, the deployment marks QuantumDiamonds' first installation in Asia and a landmark moment for the adoption of quantum sensing technology in high-volume semiconductor failure analysis.
QuantumDiamonds's QDm.1 system delivers non-destructive, high-resolution 3D imaging of current pathways in advanced chip architectures, including 2.5D and 3D packages, backside power networks, and wide bandgap materials such as GaN and SiC.
"Completing our first Asia installation at iST is a defining moment for QuantumDiamonds," said Peter Lemmens, managing director APAC at QuantumDiamonds. "Hsinchu is home to some of the most sophisticated chip manufacturing and testing operations in the world. Being embedded here, in partnership with a laboratory of iST's caliber, gives us an outstanding platform to demonstrate what quantum sensing can deliver - and to build from."
iST, one of Asia's leading independent semiconductor testing and failure analysis laboratories, selected the QDm.1 to strengthen its failure analysis capabilities for customers operating at advanced technology nodes and in advanced packaging architectures. The system is now fully operational at iST's Hsinchu facility, located at the heart of Taiwan's world-renowned semiconductor cluster.
"Taiwan is the epicentre of advanced semiconductor manufacturing, and iST is one of the most respected failure analysis laboratories in the region," said Kevin Berghoff, CEO of QuantumDiamonds. "This installation is more than a commercial milestone - it is validation that quantum sensing is ready for the most demanding real-world environments in the industry. We are proud to partner with iST and look forward to supporting their customers with a capability that simply did not exist before."
"Our customers are working at the leading edge of chip complexity, and they need failure analysis tools that can keep pace," said Dr. Sean Shen, director of Failure Analysis Engineering Division at iST. "The QDm.1 gives our engineers a fundamentally new way to interrogate advanced devices - non-destructively, in three dimensions, and at a speed that fits our workflow. We see significant potential for this technology across the range of advanced packaging and high-density interconnect challenges our customers face."
