Xanadu and EV Group partner on quantum hardware
Xanadu Quantum Technologies, a Canadian photonic quantum computing company, and EV Group (EVG), a European supplier of wafer bonding and lithography equipment, have announced a partnership to develop heterogeneous integration and wafer bonding processes to help scale photonic quantum systems.
Xanadu and EVG expect to use EVG’s industrial manufacturing tools to make the chips used in Xanadu’s photonic quantum computers, with the goal of accelerating the progression of quantum computing chip manufacturing from lab-based demonstrator systems to high-volume production devices.
As the semiconductor and photonics industries evolve, heterogeneous integration (the combination of multiple functional materials and platforms—such as silicon, lithium niobate, and III-V semiconductors—onto a single chip) has emerged as a high-growth frontier.
“Heterogeneous integration is the key to unlocking the next generation of photonic performance,” said Christian Weedbrook, founder and CEO of Xanadu. “Working with EV Group allows us to push the boundaries of what’s possible on-chip, bringing us ever closer to a useful, large-scale quantum data center.”
“This partnership is a clear demonstration of how established semiconductor technologies can accelerate next-generation high-performance computing, and quantum is the next frontier,” said Paul Lindner, executive technology director at EVG.
“We are proud to support Xanadu by providing the high-precision bonding and interface engineering solutions required to unite and scale complex photonic platforms. This collaboration demonstrates how our advanced integration technologies are paving the way for the quantum computing era.”
Pictured above: Xanadu team visits EV Group's headquarters in Austria.
