Efficient Power Conversion Corporation’s (EPC) family of enhancement-mode gallium nitride on silicon (eGaN™) power FETs have been awarded the “Editor’s Choice Award” in the power device and module segment of the 2010 EDN China Innovation Awards.
Ultratech, a supplier of lithography and laser-processing systems used to manufacture semiconductor devices and high-brightness LEDs (HB-LEDs), today announced the opening of its Singapore international headquarters.
Verticle, Inc of Dublin, California has announced the world's first hexagonal LED chip. HoneycombTM LED Chip, named after its hexagonal shape, is a vertically structured LED chip developed especially for high power LED applications.
CEA-Leti, coordinator of the European HELIOS project to accelerate commercialization of silicon photonics, said today project partners demonstrated a laser and a 10Gb/s silicon modulator using a process that is compatible with complementary metal-oxide semiconductor (CMOS) processing.
Demonstrating its key role in helping drive the most advanced 3G and 4G mobile devices, ANADIGICS, Inc. today announced that its power amplifiers have been selected by Samsung for their highly anticipated GALAXY Tab product.
Advanced Photonix a vertically integrated optoelectronic semiconductor manufacturer of optoelectronic solutions, high-speed optical receivers and terahertz instrumentation, has announced that its second quarter 2011 revenue increased by 29% and EBITDA improved by $675,000 compared to the prior year's second quarter results.
The firm says it has developed the first device of this kind, which employs 14 Gb/s VCSEL technology, for use in HPC and 16X fibre channel applications. Finisar will demonstrate the product at the annual SC10 conference in New Orleans between 15 & 18 November 2010.