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Monday 19th October 2009
Chinese foundry secures license to IBM’s RF CMOS technology and stakes claim as an advanced foundry for the sector
Sunday 18th October 2009
In light of the recent SPP and ATL merger, it has been suggested that those in the compound semiconductor industry will benefit from the move.
Saturday 17th October 2009
IMEC announced a mechanically stacked GaAs/Ge multijunction solar cell. This is the first demonstrator of IMEC’s technology to produce mechanically stacked multijunction solar cells, aiming at efficiencies above 40%.
Saturday 17th October 2009
TriQuint Semiconductor is enabling network operators to efficiently and economically meet the demand for broadband services with new solutions for cable systems, microwave radio and optical networks.
Friday 16th October 2009
Companies with potentially revolutionary cell designs like the UK’s Quantasol and Canada’s Cyrium are claiming their slice of CPV revenues.
Friday 16th October 2009
Elevated competition can even be seen in Spectrolab’s August 26 announcement that it has regained the record for the highest-efficiency triple junction cell. Beyond the irony that this coincided with Solar Systems’ problems coming to light, it demonstrates a strong emerging transatlantic rivalry.
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Friday 16th October 2009
California Eastern Laboratories (CEL) has shipped its new MeshConnect Extended Range Module.
Friday 16th October 2009
Leti’s planar-SOI technology meets low power 22nm node requirements for ‘green’ products
Thursday 15th October 2009
Compound semiconductors could help the industry deal with current physical limitations of some research, it has been suggested.
Thursday 15th October 2009
Peregrine Semiconductor Corporation has announced it has recently shipped its halfbillionth UltraCMOS RFIC, a milestone which highlights the successful adoption and proliferation of the Company’s disruptive UltraCMOS silicon-on-sapphire technology.
Thursday 15th October 2009
Tower Semiconductor and its subsidiary, Jazz Semiconductor have announced the availability of Deep-Silicon-Via (DSV) technology available in its 0.18-micron SiGe BiCMOS
Thursday 15th October 2009
ITRI and Applied Materials collaborate to advance 3D IC technology
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Thursday 15th October 2009
Foundry IC sales are to grow at twice the rate of the overall IC industry.
Wednesday 14th October 2009
RF Micro Devices will host a conference call to review fiscal 2010 second quarter financial results on Tuesday, October 27, 2009, at 5:00 p.m. (ET).
Wednesday 14th October 2009
QuantaSol has exclusively licensed advanced materials growth technology from the University of Houston to make its manufacturing process simpler and cheaper, while further improving solar cell efficiency.
Wednesday 14th October 2009
CRAIC Technologies, an innovator of UVvisible- NIR microanalysis solutions for scientific laboratories, announces the Microspectra 10 UV-visible-NIR microscope spectrophotometer
Tuesday 13th October 2009
Sunovia Energy and partner EPIR Technologies have announced that they have fabricated single-junction and twojunction cadmium telluride (CdTe) based solar cells that have far surpassed the longstanding world record open circuit voltage (Voc) for thin film CdTe solar cells.
Tuesday 13th October 2009
3S PHOTONICS, the French manufacturer of optical and optoelectronic components for telecommunication networks, and leading supplier of ultra-high reliability components for undersea optical networks today announced that it will unveil its Next- Generation 1996 SGP Series 980nm submarine-grade pump modules.
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Tuesday 13th October 2009
Oxford Instruments Plasma Technology (OIPT) has just received a 3 system order from the prestigious new Melbourne Centre for Nanofabrication (MCN) in Australia.
Tuesday 13th October 2009
Frost and Sullivan announce the top ten emerging technologies to invest in
Monday 12th October 2009
EV GROUP UNVEILS NEXT-GENERATION UV-NANOIMPRINT LITHOGRAPHY (UV-NIL)
Monday 12th October 2009
EV GROUP SECURES ORDER FOR 300-MM WAFER BONDER
Monday 12th October 2009
EV GROUP TO COLLABORATE WITH APPLIED MATERIALS ON THIN WAFER BONDING TECHNOLOGY FOR 3D IC DEVELOPMENT
Monday 12th October 2009
EV GROUP’S GEMINI WAFER BONDER SELECTED BY LEADING KOREAN RESEARCH CENTER AND FOUNDRY SERVICE PROVIDER RFID/USN FOR 3D MEMS MANUFACTURING

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