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Panasonic To Show New GaN/SiC Devices At APEC 2019

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Exhibits include 600V X-GaN power devices, SiC-DioMOS, and a GaN bidirectional switch

Panasonic Corporation will show its GaN/SiC power devices and related products at the Applied Power Electronics Conference and Exposition 2019, APEC 2019, which will be held in Anaheim, California from March 17 to 21, 2019. Exhibits include 600V X-GaN power devices; SiC-DioMOS devices and SiC modules; and a new GaN bidirectional switch.

By employing a proprietary structure, Panasonic's 600V GaN power device, X-GaN, achieves normally-off and current collapse free characteristics, thereby enabling a size reduction and improving the efficiency of power conversion systems. Alongside these devices, Panasonic will also show industrial subsystems that can take full advantage of the X-GaN's high performance, as well as application demos and an evaluation kit for checking the X-GaN performance.

Panasonic's SiC-DioMOS devices and SiC modules are built around its proprietary DioMOS (Diode-integrated MOSFET) structure. This approach enables a size reduction of SiC modules by adding the free-wheel diode functionality (necessary for power supplies and inverters) to transistors.

Also on show will be a new GaN switch capable of switching bidirectional and single directional current conduction. It has high voltage isolation with a single element. Because the bidirectional switch enables the reduction of conduction losses and the number of elements for this switching system, it contributes to the downsizing and higher conversion efficiency of power converter circuits. Panasonic will show small DBM (Drive-by-Microwave) isolated gate drivers that can drive the switch.



CS International 26-27 March 2019, Sheraton Airport Hotel, Brussels

In its ninth year, CS International will continue to provide timely, comprehensive coverage of every important sector within the compound semiconductor industry. Presentations are split into 5 key themes and each industry key theme will be delivered by a keynote presentation from a leading industry figure as well as a market analyst presentation tailored to the theme. Together, the talks will detail breakthroughs in device technology; offer insights into the current status and the evolution of compound semiconductor devices; and provide details of advances in tools and processes that will help to drive up fab yields and throughputs. Attendees at the two-day conference will gain an up-to-date overview of the status of the CS industry, and have opportunities to meet many other key players within this community.

Places will be limited, so register your place today: https://cs-international.net

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