News Article

Macom To Exhibit At CIOE 2019

News

Company to show solutions for next-generation PON, wireless and wireline telecom and datacentre networks

Macom will exhibit its optoelectronic and photonic components at the China International Optoelectronic Exposition (CIOE) 2019 in Shenzhen, China, September 4th - 7th 2019.

Macom will be discussing how its devices are enabling high bandwidth and low latency applications, addressing the high-performance analogue interfaces between electrical and optical domains, and providing solutions aimed at meeting the demanding size, power and signal integrity requirements of today's high-speed next-generation PON, wireless and wireline telecom and cloud datacentre networks.

The portfolio includes high-performance modulator drivers, transimpedance amplifiers (TIAs), clock/data recovery circuits (CDR), crosspoint switches, APDs, pin photodiodes, FP and DFB lasers, mixed signal PHYs and PAM-4 for enterprise and telecom optical systems operating up to 100/200/400 Gbps and beyond.


×
Search the news archive

To close this popup you can press escape or click the close icon.
×
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
{megaLeaderboard}
X
{normalLeaderboard}
Live Event