Loading...
News Article

Hitachi High-Tech to Lead Japanese Distribution of Kurt J. Lesker System

News

Hitachi High Technologies America, Inc., a subsidiary of Hitachi High-Technologies Corporation, has announced that HTA has made an agreement with Kurt J. Lesker Company for HTA and affiliated companies in the Hitachi High-Tech Group to serve as the exclusive distributor in Japan for Kurt J. Lesker’s PRO Line PVD 75 Thin Film Deposition System and PRO Line PVD 200 Thin Film Deposition System. Information regarding the systems is currently available to Hitachi High-Tech Group’s customers in Japan.

In the rechargeable battery and flexible device markets, demand has been increasing for products such as smartphones and wearable devices. Therefore, new displays, high-performance films, and other such technologies have entered commercialization, and the market continues to expand. Manufacturers’ research and development (R&D) teams will need a thin film deposition process for development of these types of devices or applications, and Kurt J. Lesker’s Thin Film Deposition Systems can supportthose efforts.

Kurt J. Lesker is a global provider of high-quality vacuum equipment and offers extensive knowledge in the manufacturing of thin film deposition systems for R&D applications as well as production. The Hitachi High-Tech Group strives to improve technological innovation and will offer support for R&D and manufacturing processes for customers who require thin film deposition processes, targeting rechargeable battery and flexible device markets.

SiC MOSFETs: Understanding the benefits of plasma nitridation
Wolfspeed reports Q2 results
VueReal secures $40.5m to scale MicroSolid printing
Mitsubishi joins Horizon Europe's FLAGCHIP project
Vishay launches new high voltage SiC diodes
UK team leads diamond-FET breakthrough
GaN adoption at tipping point, says Infineon
BluGlass files tuneable GaN laser patents
QD company Quantum Science expands into new facility
Innoscience files lawsuit against Infineon
Riber revenues up 5% to €41.2m
Forvia Hella to use CoolSiC for next generation charging
Photon Design to exhibit QD simulation tool
Ortel transfers CW laser fabrication to Canada
Luminus adds red and blue multi-mode Lasers
PseudolithIC raises $6M for heterogeneous chiplet tech
Mesa sidewall design improves HV DUV LEDs
IQE revenue to exceed expectations
'Game-changing' VCSEL system targets clinical imaging
German start-up secures finance for SiC processing tech
Macom signs preliminaries for CHIPS Act funding
IQE and Quintessent partner on QD lasers for AI
EU funds perovskite tandems for fuel-free space propulsion
EU to invest €3m in GeSi quantum project
Transforming the current density of AlN Schottky barrier diodes
Turbocharging the GaN MOSFET with a HfO₂ gate
Wolfspeed launches Gen 4 SiC MOSFET technology
Report predicts high growth for UK's North East
Element Six unveils Cu-diamond composite
SemiQ launches hi-rel 1700V SiC MOSFETs
Lynred to exhibit Eyesential SWIR sensor for machine vision
Thorlabs buys VCSEL firm Praevium Research
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: