Compound Photonics and Plessey announce microLED prototypes
Prototypes validate successful bonding of Plessey’s GaN-on-Si microLED array wafer to CP’s 3.015 micron pixel 1080p backplane wafer
Compound Photonics US Corporation, a provider of high-resolution microdisplay solutions for Augmented Reality (AR) and Mixed Reality (MR) applications, and Plessey Semiconductors, a microLED company, have produced the first fully addressable microLED display modules resulting from their previously announced strategic partnership to develop and introduce GaN-on-Silicon microLED based microdisplay solutions for AR/MR applications.
CP and Plessey engineering teams have successfully fabricated functional microLED display modules combining CP’s high speed digital low-latency display backplane with Plessey’s breakthrough GaN-on-Silicon monolithic microLED array technology. Plessey’s team produced the microLED array wafer bonded to CP’s backplane wafer at its Plymouth, UK, facility. In turn, CP’s team assembled and packaged display modules from the bonded wafer pair at its Phoenix, AZ, USA, facility. Both teams are currently performing initial characterisation work at CP’s Vancouver, WA, USA, facility.
“Today’s milestone achievement is a direct result of the close working relationship between Plessey and CP development teams,” commented Mike Lee, President of Corporate and Business Development at Plessey. “This successful proof-of-concept demonstration validates both companies’ goals to produce the industry’s highest performance microLED display modules that deliver improved brightness at the smallest pixel sizes, higher frame rates, with extended bit depth at the lowest power consumption to best serve next-generation emissive display based AR/MR smart glasses and Heads-Up/Head-mounted displays (HUD/HMDs) applications.”
Yiwan Wong, Compound Photonics’ CEO, added: “These prototype microLED displays provide important confirmation that Plessey’s monolithic GaN-on-Silicon IP, fabrication technology and bonding processes match perfectly with CP’s industry 3.015 micron pixel pitch 1080p (1920x1080 pixel) backplane design to deliver compact high resolution microdisplays. Combined with CP’s NOVA high-performance display driver architecture, these microLED displays support an industry standard MIPI interface to take advantage of CP’s unique display pipeline solution designed for the real time needs of AR/MR applications. CP’s display drive technology is extensible across multiple display technologies enabled by full software configurability, allowing customers to build their systems for specific power and performance needs.”
Initial samples of a 0.26 inch diagonal, Full HD 1080p resolution microLED display module integrated with display driver IC and MIPI input are expected to be available by summer of 2020.