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WiPDA-Asia To Take Place Virtually And Physically

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IEEE conference in September to add virtual booths and virtual attendee options

The Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA-Asia) will be run as a 'hybrid' conference from September 23-25, 2020 at Kyoto University, Japan. As such, it will be one of the first IEEE conferences to cater for both in-person attendees and those that are not able to travel to the workshop due to potential continuing coronavirus (COVID-19) imposed restrictions.

The conference is modifying its sponsorship structure and adding virtual booth and virtual attendee options for organisations. This will enable companies to have a presence at this important meeting through the workshop's virtual exhibit available on the workshop website.

Furthermore, the organising committee is making provisions in the actual workshop schedule to have pre-recorded informative sponsor content pertaining to wide bandgap technologies to be played during the workshop to maximise views by both virtual and in-person attendees!

These pre-recorded spots must strictly adhere to the times that will be allotted, but this is an unprecedented option being piloted by WiPDA-Asia. Guidelines are being developed to share with you in this regard.

Topics that will be covered include; Hetero-epitaxial and bulk materials growth; Packaging, power modules, and ICs; Gate dielectrics and surface passivation; Hard-switched and soft-switched applications; Device structures and fabrication techniques; Common-mode and EMI management; Device characterisation and modelling; Gate drive and other auxiliary circuits; Very high efficiency and compact converters; High-performance passive components; SOAs including short-circuit, spike,and transient tolerance; Applications in renewable energy and storage, transportation, industrial drives, and grid power; Harsh environment (e.g. high temperature) operation and reliability.

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