German Research Company Orders Veeco Tool
TurboDisc MOCVD system will be used for developing technologies for wireless and broadband communication
Veeco Instruments has announced that IHP Microelectronics, based in Frankfurt, Germany, has selected Veeco's TurboDisc MOCVD system for the development of high-performance, silicon-based microelectronic technologies. IHP is an expert in the fields of silicon-based systems, highest-frequency integrated circuits, and technologies for wireless and broadband communication.
Veeco's TurboDisc platform has been the foundation of the company's compound semiconductor expertise. The proprietary technology is a key enabler forAs/P and GaN applications critical for next-generation communications infrastructure and highly efficient microelectronic devices.
Veeco says that the TurboDisc platform provides production ramping due to faster recipe capabilities up to 50 percent quicker than when using traditional batch tools. In addition, the platform also includes Veeco's IsoFlange and SymmHeat technologies, which provide homogeneous laminar flow and uniform temperature profile across the entire wafer, delivering world-class uniformity and repeatability.
“We are honoured to work with IHP, a well-respected institute and a driving force of innovation and leadership in the German and European microelectronic and communication space,” commented Ajit Paranjpe, Veeco's chief technology officer. “Their selection of our TurboDisc platform is validation of its exceptional process capabilities and ability to help enable game-changing technologies. We look forward to continuing to support IHP as they continue to innovate and execute on their mission.”
AngelTech Live III: Join us on 12 April 2021!
AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST)
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Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.
2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.
We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.
We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.
Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.
Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.
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