News Article

EPC Targets Ultra Thin Devices With 48V DC-DC Demo Boards


Two solutions for high power density DC-DC conversion target ultra-thin laptops, displays, gaming systems and other physically thin consumer electronics.

EPC has announced the availability of the EPC9148 and EPC9153 demonstration boards for 48 V DC-DC conversion. The EPC9153 is a 250 W, extremely thin, power module using a simple, low-cost synchronous buck configuration delivering a 98.2 percent peak efficiency with a maximum component height of 6.5 mm. The EPC9148 utilizes a multilevel topology enabling a maximum component height less than 4 mm, while maintaining a 98 percent peak efficiency.

Both solutions integrate Microchip Technology's dsPIC33CK digital signal controller (DSC) with the latest generation 100 volt eGaN FETs from EPC. These solutions achieve greater than 98 percent efficiency at 12.5 A in an ultra-thin footprint. The flexibility of the Microchip digital controller allows the input voltage of these boards to be adjusted from 44 V - 60 V and the output voltage from 5 V - 20 V.

The EPC9148 multilevel converter reducing the size of modules supporting magnetic components, while achieving high efficiency in a compact solution. One of the highlights on the EPC9148 board is a custom extremely thin power inductor from Würth Elektronik, which helps to enable the ultra-high power density of this design.

The EPC9153 offers a simple, low-cost synchronous buck configuration that keeps the maximum component height low, achieves 98.2 percent peak efficiency, with less than 40°C temperature rise at 20 V output. eGaN FETs improve the overall efficiency with their fast switching capability and their chip-scale footprint make it easy to cool in an effort to achieve the low temperature rise required for these compact designs.

“Computers, displays, smart phones, and other consumer electronics systems continue to become thinner and more powerful,” said Michael de Rooij, EPC's VP of applications engineering. “We are thrilled to work with partners such as Microchip Technology and Würth Elektronik to develop ultra-thin and highly efficient solutions to address the challenge of getting more power out of limited space and volume.”

Both demonstration boards are available for immediate delivery from Digi-Key.

CS International to return to Brussels – bigger and better than ever!

The leading global compound semiconductor conference and exhibition will once again bring together key players from across the value chain for two-days of strategic technical sessions, dynamic talks and unrivalled networking opportunities.

Join us face-to-face between 28th – 29th June 2022

  • View the agenda.
  • 3 for the price of 1. Register your place and gain complementary access to TWO FURTHER industry leading conferences: PIC International and SSI International.
  • Email  or call +44 (0)24 7671 8970 for more details.

*90% of exhibition space has gone - book your booth before it’s too late!


Search the news archive

To close this popup you can press escape or click the close icon.
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.

Please subscribe me to:


You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
Live Event