News Article

Mitsubishi To Launch 4-terminal 1200V SiC-MOSFETs

News

Helps to reduce power consumption and physical size of power-supply systems

Mitsubishi Electric has announced the coming launch of a new series of SiC MOSFETs, the N-series of 1200V devices in a TO-247-4 package, which achieves 30 percent less switching loss compared to the existing TO-247-3 package products.

According to the company, the new series will help to reduce the power consumption and physical size of power-supply systems requiring high-voltage conversion, such as electric vehicle on-board chargers and photovoltaic power systems. Sample shipments will start this November.

The new series devices come in a four-pin package to help reduce power consumption and physical size of power-supply systems. They feature a figure of merit (FOM3) of 1,450mΩ-nC and high self-turn-on tolerance. The TO-247-4 package is equipped with independent driver source terminal as well as conventional 3-pin package.

The four-pin package is said to help reduce parasitic inductance, a problem in high-speed switching. Eliminating gate-source voltage drops due to current variations helps to reduce switching loss by approximately 30 percent compared with TO-247-3 products.

Using a higher carrier frequency to drive the new power semiconductors helps to reduce switching-power loss, enabling smaller and simpler cooling systems as well as smaller reactors and other peripheral components, thereby helping to reduce the power consumption and physical size of overall power-supply systems.

There will be six models for a variety of applications including models compatible with Automotive Electronics Council's AEC-Q101 standards for use not only in industrial applications, e.g. photovoltaic systems, but also EV applications.

Creepage distance (shortest distance over surface between two conductive parts) between drain terminal and source terminal made wider than in TO-247-3 package products for more flexible application, including in outdoor installations where dust and dirt easily accumulate.

CS International to return to Brussels – bigger and better than ever!


The leading global compound semiconductor conference and exhibition will once again bring together key players from across the value chain for two-days of strategic technical sessions, dynamic talks and unrivalled networking opportunities.


Join us face-to-face between 28th – 29th June 2022

  • View the agenda.
  • 3 for the price of 1. Register your place and gain complementary access to TWO FURTHER industry leading conferences: PIC International and SSI International.
  • Email info@csinternational.net  or call +44 (0)24 7671 8970 for more details.

*90% of exhibition space has gone - book your booth before it’s too late!

Register


×
Search the news archive

To close this popup you can press escape or click the close icon.
×
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
{megaLeaderboard}
X
{normalLeaderboard}
Live Event