Onto Announces New Inspection Platform
Latest inspection advances have resulted in multiple orders
Onto Innovation has announced the availability of its new Dragonfly G3 inspection platform designed to meet advanced 2D and 3D sensitivity requirements for advanced packaging and specialty device manufacturers.
The Dragonfly G3 platform includes a newly designed optical system with sub-micron resolution, greatly improving 2D defect detection capability in either bright field, dark field or Clearfind illumination modes. In addition to greater sensitivity, the system is said to scan more than 30 percent faster than the previous platform.
It also uses a redesigned 3D metrology system called the LT-200, using a new dual head design that improves the 3D bump measurement throughput up to 50 percent. Onto Innovation software further differentiates this solution with Discover Defect software, which provides a process control suite in real time for an expanding range of complex application such as 5G.
Ju Jin, vice president and general manager of Onto Innovation's inspection business said, “This new suite of products provides our leading-edge customers with the technology they need to develop and produce high performance products in two rapidly growing markets: high-end specialty devices; and advanced system-in-packages also referred to as chiplets. In these markets we have seen rapid reductions in feature sizes. These reductions require more sensitive tools providing repeatable and accurate data.
“The growing specialty device market, which includes next-generation power devices, RF filters, amplifiers, CIS and lidar sensors, now requires process control equipment beyond the capabilities of legacy systems in order to detect smaller and new defect types,” Jin continued.
The first Dragonfly G3 system was delivered to an assembly and test partner in Q4 2020. Orders received from a leading CMOS image sensor (CIS) manufacturer will be shipped in the first quarter of 2021 along with additional evaluation units to logic and memory customers.
“The capabilities of the new Dragonfly platform were an important factor in our recent win at a second high-end CIS manufacturer. The incumbent tools were unable to see these low contrast defects of interest on critical layers. Our new optical resolution demonstrated that it was able to detect these defects repeatably at high volume manufacturing speed to improve yield.”
Kevin Heidrich, senior vice president of marketing added, “The advanced packaging market is exploding with a wide variety of packaging technologies and architectures. Manufacturers now require a single comprehensive system, that can handle 2D and 3D inspection and detect flaws that may cause early life failure. Our sub-micron sensitivity is critical for complex packaging designs requiring redistribution lines (RDL) approaching 1µm design rules. The Dragonfly G3 system is also enhanced by updated Clearfind technology. With new optics and advanced image processing algorithms, the new version of Clearfind can find a greater range of photoresist and chemical residues at faster speeds.”
Heidrich continued, “In addition to faster and more accurate data acquisitions, customers want to make real time and data-driven decisions. Our release of TrueADC AI, which includes our proprietary multi-engine deep learning approach with the Dragonfly G3 platform, provides a complete solution for our customers. This solution has improved upon the rate of misclassifications by 30-50 percent while still outperforming manual classification rates by over 400 percent. This solution results in higher quality yield, and less scrap, complementing factory environmental missions around the world.”