Infineon introduces CoolGaN IPS family
Integrated power stage family targets applications in the 30 to 500W power range
Infineon has added the new CoolGaN IPS family of integrated power stage (IPS) products to its broad portfolio of WBG power devices. The initial IPS portfolio consists of half-bridge and single-channel products, targeting low-to medium power applications, including chargers and adapters and switched-mode power supplies (SMPS).
The 600 V CoolGaN half-bridge IPS IGI60F1414A1L is ideally suited for compact and lightweight designs in the low-to-medium power range. Coming in a thermally enhanced 8x8 QFN-28 package, it enables systems with high power density. The product combines two 140 mΩ / 600 V CoolGaN e-mode HEMT switches with dedicated galvanically isolated high- and low-side gate ivers out of Infineon’s EiceIVER family.
The IGI60F1414A1L is easy to control due to the isolated gate driver with two digital PWM inputs. The integrated isolation function, the clean separation of digital and power ground and the reduced complexity of the PCB layout are crucial in achieving shorter development time, lower system bill-of-material and lower total cost. The gate driver’s input-to-output isolation is based on Infineon’s proven on-chip coreless transformer (CT) technology. This guarantees high speed and excellent robustness even for extremely fast switching transients with voltage slopes exceeding 150 V/ns.
The switching behavior of IGI60F1414A1L can be easily adapted to the needs of different applications by means of a few passive gate path components. This allows slew rate optimisation for example to reduce electromagnetic interference (EMI) efforts, steady-state gate current setting, and negative gate ive for robust operation in hard-switched applications.
Furthermore, due to the system-in-package integration and the highly accurate and stable propagation delay of the gate ivers, the IGI60F1414A1L enables the lowest possible system dead-times. This helps to maximise system efficiency, leading to the next level of power density up to 35 W/in³ for charger and adapter solutions. Flexible, easy and fast designs are also enabled for other applications, including LLC resonant topology and motor drives.