Automotive chip maker chooses Oxford Instruments
German semiconductor manufacturer to use PlasmaPro 100 Cobra system for the development of next generation GaN power devices
Oxford Instruments Plasma Technology has announced that a German semiconductor manufacturer to the automotive industry has selected its PlasmaPro 100 Cobra atomic layer etching (ALE) system for the development of next generation GaN power electronic devices.
The PlasmaPro100 Cobra system is designed for superior uniformity, high- precision and low-damage process solutions. The production-proven system allows for rapid change between wafer sizes up to 200 mm and the cost of ownership is one of the lowest in the market.
The PlasmaPro100 Cobra system will be incorporated into the R&D section and will be used for development of GaN power devices. GaN power devices are gaining market share in fast charger applications and offer benefits in electric vehicle power management systems.
"Our Atomic Scale Processing etch solution being selected by this world leading manufacturer for their GaN power electronics programme is an important strategic win for Oxford Instruments Plasma Technology" comments Klaas Wisniewski, Plasma Technology’s strategic business development director.
He added: "The GaN based power electronic market is very dynamic with improvements to both performance and cost expected at each design iteration.
"This reiterates the importance of our strategy to focus on atomic scale processing solutions such as atomic layer deposition (ALD) and atomic layer etching (ALE). We are pleased that such a leading automotive semiconductor company recognises the benefits our solutions deliver. "