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2021 IEDM To Highlight Novel Semiconductor Technology


Popular IEDM Tutorials and Short Courses already set for 67th annual IEDM

The 67th annual IEDM is scheduled for December 11-15, 2021 at the Hilton San Francisco Union Square hotel under the theme 'Devices for a New Era of Electronics: From 2D Materials to 3D Architectures'.

While the comprehensive technical program for the 2021 IEEE International Electron Devices Meeting (IEDM) will be finalised in the fall, the popular IEDM Tutorials and Short Courses are already set. The broad reach, interdisciplinary nature and technical depth of the topics that will be discussed in these educational events can serve as a “crystal ball” of sorts to show where the industry is headed.

At IEDM each year, the world's best scientists and engineers in nano/microelectronics gather to participate in a technical program consisting of more than 220 presentations, along with a variety of panels, focus sessions, Tutorials, Short Courses, a supplier exhibit, IEEE/EDS award presentations and other events highlighting leading work in more areas of the field than any other conference.

“As the COVID-19 pandemic has demonstrated, the world is becoming increasingly reliant on electronic technologies. The good news is that the IEDM Tutorials and Short Courses will provide attendees with the invaluable knowledge and information needed to advance the state-of-the-art in critical areas of the field,” said Meng-Fan (Marvin) Chang, IEDM 2021 publicity chair, IEEE Fellow, distinguished professor of Electrical Engineering at National Tsing Hua University, and director of Corporate Research at TSMC. “The opportunity to engage with the world's technical leaders in these highly specialized areas is one of the hallmarks of the IEDM conference.”

“New, fast-growing electronics applications often require novel semiconductor solutions,” said Srabanti Chowdhury, IEDM 2021 Publicity Vice Chair and Associate Professor of Electrical Engineering at Stanford University. “The IEDM Tutorials and Short Courses represent a great opportunity to explore evolving areas of the field, with topics that include novel materials and device types; advances in process and packaging technologies; new design approaches; and much more.”

IEDM Tutorials - Saturday, Dec. 11

Now in their 12th year, the 90-minute Saturday tutorial sessions on emerging technologies and specialised topics have become a hugely popular part of IEDM. They are presented by experts in the respective areas, the goal being to bridge the gap between textbook-level knowledge and leading-edge current research. The topics for 2021 are:

2:45 p.m. - 4:15 p.m.

• Beyond the FinFET Era: Challenges and Opportunities for CMOS Technology, Kai Zhao, IBM

• TCAD-Based DTCO and STCO, Asen Asenov, University of Glasgow

• 6G Technology Challenges from Devices to Wireless Systems, Aarno Pärssinen, Oulu University

4:30 p.m. - 6:00 p.m.

• Selective and Atomic-Scale Processes for Advanced Semiconductor Manufacturing, Robert Clark, TEL

• Machine Learning for Semiconductor Device and Circuit Modeling, Elyse Rosenbaum, University of Illinois, Urbana-Champaign

• GaN Power Device Technology and Reliability, Dong Seup Lee, Texas Instruments

IEDM Short Courses - Sunday, Dec. 12

In contrast to the Tutorials, the full-day IEDM Sunday Short Courses are focused on a single technical topic. Early registration is recommended, as they are often sold out. They offer the opportunity to learn about important areas and developments, and to network with global experts.

• Future Scaling and Integration Technology, organized by Dechao Guo, IBM Research

◦ Processes and Materials Engineering Innovations for Advanced Logic Transistor Scaling, Benjamin Colombeau, Applied Materials

◦ Interconnect Resistivity: New Materials, Daniel Gall, Rensselaer Polytechnic Institute

◦ Metrology and Material Characterization for the Era of 3D Logic and Memory, Roy Koret, Nova Ltd.

◦ Beyond FinFET Devices: GAA, CFET, 2D Material FET, Chung-Hsun Lin, Intel

◦ Heterogenous Integration Using Chiplets & Advanced Packaging, Madhavan Swaminathan, Georgia Tech

◦ Design-Technology Co-Optimization/System-Technology Co-Optimization, Victor Moroz, Synopsys

• Emerging Technologies for Low-Power Edge Computing, organized by Huaqiang Wu, Tsinghua University and John Paul Strachan, Forschungszentrum Jülich

◦ Mobile NPUs for Intelligent Human/Computer Interaction, Hoi-Jun Yoo, KAIST

◦ Brain-Inspired Strategies for Optimizing the Design of Neuromorphic Sensory-Processing Systems, Giacomo Indiveri, University of Zurich

◦ Memory-Based AI & Data Analytics Solutions, Euicheol Lim, SK hynix

◦ Material Strategies for Memristor-Based AI Hardware and their Heterointegration, Jeehwan Kim, MIT

◦ RRAM Devices for Data Storage and In-Memory Computing, Wei Lu, University of Michigan

◦ Practical Implementation of Wireless Power Transfer, Hubregt Visser, IMEC

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