Meister Abrasives to participate in SiC conference
Swiss abrasives firm to participate in 13th European Conference on SiC and Related Materials in October 2021
For the first time ever, Swiss company Meister Abrasives will take part in the European Conference on SiC and Related Materials (ECSCRM). The 13th edition of the conference will take place in October 24-28, 2021 in Tours, France.
The ECSCRM held at the Vinci International Convention Centre (Le Vinci-Palais des Congrès) and hosted by the University of Tours, aims at discussing the advances in SiC technologies. As an official exhibitor, Meister Abrasives will present its latest technological innovation in the area of SiC and semiconductor solutions – the Ultra-Fine 6 (UF6).
Hybrid and ceramic bond grinding tools represent a quantum leap in quality and reliability in semiconductor processing, according to Meister Abrasives. The company sells diamond grinding tools that target fine grinding of wafers and wafer dicing. They offer high quality total thickness variation (TTV) values, surface qualities in the one- digit Angstrom range are achieved.
The specially developed grinding tools of Meister Abrasives are used for processing materials such as Si, SiC, sapphire, GaN, InP, GaAS, LnNb, LnTa and extreme hard ceramics. Meister Abrasives has developed an innovative UF6 grinding wheel technology that allows prime wafer and device manufacturers to shorten wafer preparation steps to the minimum. The ultra-smooth surface profile achieved with this method enables manufacturers to avoid diamond slurry costs, reduce chemical mechanical polishing (CMP) cost tremendously and drastically increase throughput.
