News Article

Aehr Joins PowerAmerica Institute

News

Wafer test and burn-in equipment company to support advancing SiC and GaN power electronics

Aehr Test Systems, a supplier of semiconductor test and reliability qualification equipment, has joined the PowerAmerica Institute, a public-private research initiative dedicated to accelerating the adoption of high performing, next generation SiC and GaN power electronics.

The collaboration will result in bringing next generation SiC and GaN power electronics to markets faster, reducing cost and risk factors associated with new generation technologies.

An organisation that brings together the semiconductor manufacturers and the companies that use semiconductor power electronics in their products, PowerAmerica Institute is well placed as an information hub. With the backing of the US Department of Energy and the engagement of top researchers, knowledge and processes can be provided to educate the American workforce and provide more innovative product designs.

“Wafer test and burn-in equipment play a key role in high volume SiC and GaN production, as wafer level stress testing contributes to highly reliable SiC and GaN power electronic products," said Victor Veliadis, executive director of PowerAmerica. "We welcome Aehr to the PowerAmerica family and look forward to working with them to accelerate the adoption of wide bandgap technology.”

Gayn Erickson, president and CEO of Aehr Test Systems, commented: “Aehr Test is excited about becoming the newest member of PowerAmerica and joining the other prestigious organisations in advancing wide bandgap (WBG) SiC and GaN technologies and accelerating the next generation of power electronics. We look forward to joining some of the brightest minds in WBG research, device manufacturing, power electronics and systems, with the objective of reducing cost and the inherent risks in this new technology.

“Wide bandgap semiconductors permit devices to operate at much higher temperatures, voltages, and frequencies, making the power electronic modules using these materials significantly more powerful and energy efficient than those made from conventional semiconductor materials. The benefits of bringing the more robust and cost effective SiC and GaN technologies to market will drive longer range in electric vehicles, along with energy savings in consumer, data center and industrial processes and help deliver renewable energy onto the electric grid.”

CS International to return to Brussels – bigger and better than ever!


The leading global compound semiconductor conference and exhibition will once again bring together key players from across the value chain for two-days of strategic technical sessions, dynamic talks and unrivalled networking opportunities.


Join us face-to-face between 28th – 29th June 2022

  • View the agenda.
  • 3 for the price of 1. Register your place and gain complementary access to TWO FURTHER industry leading conferences: PIC International and SSI International.
  • Email info@csinternational.net  or call +44 (0)24 7671 8970 for more details.

*90% of exhibition space has gone - book your booth before it’s too late!

Register


×
Search the news archive

To close this popup you can press escape or click the close icon.
×
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
X
Live Event