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ACM Research Adds New Compound Semiconductor Tools

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Portfolio of wet processing products addresses growing demand from electric vehicle, 5G communication and AI markets

ACM Research, a supplier of wafer processing solutions, has introduced a tool set to support compound semiconductor manufacturing.

The 150mm-200mm bridge systems support front-end cleaning and a wide range of WLP applications for compound semiconductors including GaAs, GaN and SiC processes.

The wet process portfolio includes coater, developer, photoresist (PR) stripper, wet etcher, cleaner and metal plating tools that feature automated systems for flat or notched wafers.

“The compound semiconductor industry is growing rapidly, with demand increasing across a variety of end markets,” said David Wang, president and CEO of ACM. “ACM has leveraged its expertise and technology in front-end and WLP tool sets to deliver high-performance and cost-effective systems to address the specific technology requirements of compound semiconductors. We believe the market for compound semiconductor capital equipment offers significant growth opportunities to ACM, as GaAs, GaN and SiC devices are becoming an increasingly integral part of future electric vehicle, 5G communication system and artificial intelligence solutions.”

CS International to return to Brussels – bigger and better than ever!


The leading global compound semiconductor conference and exhibition will once again bring together key players from across the value chain for two-days of strategic technical sessions, dynamic talks and unrivalled networking opportunities.


Join us face-to-face between 28th – 29th June 2022

  • View the agenda.
  • 3 for the price of 1. Register your place and gain complementary access to TWO FURTHER industry leading conferences: PIC International and SSI International.
  • Email info@csinternational.net  or call +44 (0)24 7671 8970 for more details.

*90% of exhibition space has gone - book your booth before it’s too late!

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