Microchip Unveils 3.3 kV SiC Power Devices
3.3 kV SiC MOSFETs and SBDs extend designers’ options for high-voltage power electronics in transportation, energy and industrial systems
Microchip Technology has announced the expansion of its SiC portfolio with the release of very low on-resistance 3.3 kV SiC MOSFETs and high current-rated SiC SBDs, enabling designers to take advantage of ruggedness, reliability and performance.
The devices are for electrified transportation, renewable energy, aerospace and industrial applications.
Until now, the availability of 3.3 kV SiC power devices has been limited. Microchip’s 3.3 kV MOSFETs and SBDs join the company’s portfolio of SiC solutions that include 700V, 1200V and 1700V die, discretes, modules and digital gate drivers.
Microchip’s 3.3 kV SiC power devices include MOSFETs with what is claimed to be the industry’s lowest RDS(on) of 25 mΩ and SBDs with the industry’s highest current rating of 90 A. Both MOSFETs and SBDs are available in die or package form. These new levels of performance enable designers to simplify their design, create higher-power systems and use fewer paralleled components for smaller, lighter and more efficient power solutions.
“We focus on developments that provide our customers the ability to quickly innovate systems and move their end products into a competitive advantage position faster,” said Leon Gross, vice president of Microchip’s discrete product business unit.
“Our new family of 3.3 kV SiC power products allows customers to move to high-voltage SiC with ease, speed and confidence and benefit from the many advantages of this exciting technology over silicon-based designs.”
Microchip has released hundreds of SiC power devices and solutions to production over the last three years, ensuring designers can find the right voltage, current and package fit for their application requirements. The company’s devices are backed by its customer-driven obsolescence practice, which ensures devices will continue to be produced for as long as customers need them, and Microchip can produce them.
The expanded SiC portfolio is supported by a range of SiC SPICE models compatible with Microchip’s MPLAB® Mindi™ analog simulator modules and driver board reference designs. The Intelligent Configuration Tool (ICT) enables designers to model efficient SiC gate driver settings for Microchip’s AgileSwitch® family of configurable digital gate drivers.
These 3.3 kV SiC die and discrete devices in a variety of package options are available for order in production quantities.
