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ST Hosts 'Electronique 2030' Program

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ST is one of the leaders of the five-year French strategic program supporting R&D and First Industrial Deployment in microelectronics

STMicroelectronics hosted the President of the French Republic Emmanuel Macron, along with key ministers and representatives from national, regional and local authorities at ST research, development and manufacturing site of Crolles, near Grenoble (France) for the launch of the French Electronique 2030' Program.

ST's partners from the semiconductor and electronics industry were also present, including GlobalFoundries, CEA-Leti and Soitec.

The 'Electronique 2030' program, part of the 'France 2030' investment plan announced in October 2021, aims to keep France in a leading position and address current and future challenges in electronics from upstream research to applications.

At the European Level, 20 European Member States have decided to build upon the success of a first 'IPCEI on Microelectronics (IPCEI ME)' to launch a new IPCEI, 'The IPCEI on Microelectronics and Communications Technologies (IPCEI ME/CT)', in coordination with the European Commission.

This new IPCEI, with more than 100 participants, will target the whole value chain of semiconductors, supporting not only research, development, and innovation (RDI), but also First Industrial Deployment (FID). The IPCEI ME/CT is organised into four workstreams: SENSE (digital perception), THINK (embedded processing), ACT (power electronics), and COMMUNICATE (components for Communications).

Emmanuel Macron announced France's support to ST, as well as to 14 other French leading participants in the IPCEI ME/CT, from 2022 to 2026. It directly supports ST's participation in the four workstreams, through its R&D and manufacturing sites, notably at Crolles, Grenoble, Rennes, Rousset, and Tours.

This will include R&D in innovative power electronics using GaN on Silicon, smart optical sensors using advanced 3D integration, and embedding AI, Radio frequency technologies and devices for 5G and 6G, as well as high performance for low power MCUs and technologies, including a new embedded Phase Change Memory FD-SOI technology, AI at the edge using innovative embedded memory CMOS technologies architectures, among others.

Funding for the IPCEI ME/CT is subject to approval by the European Commission.

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