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Delta to use CoolSiC devices for bi-directional inverter


Infineon tech allows integration of three applications into one system to allow EVs to be used as buffer storage for solar power

Delta Electronics, a Taiwan-based provider of power and energy management solutions, is using Infineon's CoolSiC products to support a bi-directional inverter.

With the successful development of bi-directional inverters, a hybrid three-in-one system that integrates solar, energy storage and charging of electric vehicles (EV), Delta is enabling EVs to become an household emergency backup power.

The bi-directional inverter can be used to supply power to charge electric vehicles (EVs) and home batteries, while acting as a backup power for unexpected outages and a high-efficiency green energy control core.

Products from Infineon include the 1200 V M1H CoolSiC EasyPACK 1B modules and 1200 V CoolSiC D²PAK 7-pin, a surface mount device. The integration of three applications is also a milestone. This three-in-one system was realised in a compact package of just 425 x 865 x 160 mm 3. With an output power of about 10 kW, the system allows a maximum continuous current of 34 A and achieves peak efficiencies of more than 97.5 percent.

“Infineon is a trusted brand that has been spearheading the development of power semiconductors and power efficiency for many years”, said Raymond Lee, director of Delta PV Inverter business unit. “With the company's devices, we were able to integrate three applications into one system, which allows us to take a giant leap toward green energy.”

“We are proud to be a big part of this project, representing a major milestone on the road to carbon neutrality,” said Peter Wawer, president of Infineon’s Industrial Power Control Division. “We look forward to a long-term collaboration between Infineon and Delta and are proud that our devices contribute to this smart energy solution.”

One of the essential elements for creating the three-in-one system includes the 1200 V M1H CoolSiC EasyPACK 1B module (F4-23MR12W1M1_B11) with integrated NTC temperature sensor and PressFIT contact technology. The module offers maximum flexibility and high-current density. With best-in-class package technology combined with CoolSiC MOSFETs, the module features a low-inductive design with minimal switching and conduction losses. Furthermore, high-switching frequency operation is enabled on the customer side, which allows for smaller system designs. The EasyPACK module helps optimise the development time and reduces the overall costs for the customer.

Several other components from Infineon are used in the system, including devices using CoolMOS C7 and TRENCHSTOP 5 IGBT technologies. Additionally, the 1200 V CoolSiC MOSFET (IMBG120R350M1H) in a surface-mounted device (SMD) package, the D²PAK 7-pin, is also a part of this system. This device uses .XT interconnection technology for best-in-class thermal properties, as well as the Kelvin source concept. The MOSFETs ensure very low switching losses, improving the system’s efficiency.

The devices include a 3 µs short-circuit resistance, and the MOSFETs provide full slew rate (dV/dt) control as well as a benchmark gate threshold voltage (V GS(th)) of 4.5 V. They are also robust against parasitic turn-on and can be operated with a turn-off voltage of 0 V. Furthermore, the MOSFETs contain a robust body diode that enables hard commutation. The package creepage and clearance distances are 6.1 mm. Additionally, the SMD package allows direct integration into PCBs with natural convection cooling without additional heat sinks.

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