+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
News Article

II-VI Closes $100M SiC Substrates Contract

News

Contract to supply Dongguan Tianyu Semiconductor with 150 mm SiC substrates begins this quarter

II-VI has closed an over $100 million contract to supply Dongguan Tianyu Semiconductor Technology with SiC substrates to be delivered beginning this quarter. Tianyu, one of China's first and largest SiC epitaxial wafer manufacturers, has signed a long-term supply contract, with upfront payments, to secure 150 mm SiC substrate capacity that will meet its demand through calendar year 2023.

“In November 2021, we were pleased to announce that Tianyu had selected II-VI as its primary strategic partner for the supply of 150 mm SiC substrates for power electronics,” said Sohail Khan, executive VP, New Ventures & Wide-Bandgap Electronics Technologies Business Unit. “With the end-demand ramping up significantly, it became essential for Tianyu to secure its supply with this long-term, high-volume contract, which will be recurring and grow in value over time.”

To meet the market demand in Asia, II-VI established in 2021 a backend processing line for SiC substrates, in over 50,000 sq. ft. of new cleanroom space, at II-VI's Asia Regional Headquarters in Fuzhou, China. Tianyu will benefit from II-VI's 150 mm SiC global production capacity in both the US and in China.

Tianyu and II-VI aim to provide a high-quality and reliable supply chain and future 200 mm capability that will be critical to support the rapidly growing demand for SiC power electronics in electric vehicles (EVs), renewable energy, smart grids, microgrids, and power supplies for data networks.

CS International to return to Brussels – bigger and better than ever!


The leading global compound semiconductor conference and exhibition will once again bring together key players from across the value chain for two-days of strategic technical sessions, dynamic talks and unrivalled networking opportunities.


Join us face-to-face on 18-19 April 2023

  • View the agenda.
  • 3 for the price of 1. Register your place and gain complementary access to TWO FURTHER industry leading conferences: PIC International and Power Electronics International.
  • Email info@csinternational.net  or call +44 (0)24 7671 8970 for more details.

Register


×
Search the news archive

To close this popup you can press escape or click the close icon.
×
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: