Loading...
News Article

ELPHiC samples Integrated InP optics/electronics receiver

News

New generation InP integrated receiver and laser-diode targets PON and datacom applications

ElectroPhotonic-IC (ELPHiC), a Canadian company focused on new generation InP chips, has announced samples of its integrated optics/electronics receiver. This follows the sampling of its 10G 1271 laser for ONU application that has showed very high reliability.

ELPHiC has developed an opto-electronic integration technology, which it says leads to a new generation of InP chips enabling higher performance, lower power consumption, and increased reliability for lasers and PIN receivers. The integration approach eliminates the need for APDs, thus reducing the cost of the receiver.

According to Jim Hjartarson, CEO of ELPHiC: “By integrating key optical and electronic elements on the same InP semiconductor substrate with the analogue amplification circuitry, we create an architectural shift in building optics chipsets that significantly improve performance and power, lower cost, and reduce module form factor. Our patented PIN architecture also allows for sensitivity levels comparable to those of APDs.”

Christian Ilmi, VP Worldwide Sales, who recently joined ELPHiC from the optical module manufacturing industry, added: “The demand for lasers and receivers from module manufacturers of PON and Datacom markets has seen an unprecedented increase over the past 3 years. The recently announced government funding for PON deployments will add even more pressure to this demand. ELPHiC’s timing for cheaper and more effective optics could not be better.”

Joe Costello, chairman of the board of ELPHiC and Silicon Valley veteran said: “Finally the promise of monolithic integration of optical devices and electronics are coming to market. With the benefits of ELPHiC’s technology, the performance of optical links in PON, data centres and other emerging innovative markets will take a giant leap forward”.

QD company Quantum Science expands into new facility
Innoscience files lawsuit against Infineon
Riber revenues up 5% to €41.2m
Forvia Hella to use CoolSiC for next generation charging
Photon Design to exhibit QD simulation tool
Ortel transfers CW laser fabrication to Canada
Luminus adds red and blue multi-mode Lasers
PseudolithIC raises $6M for heterogeneous chiplet tech
Mesa sidewall design improves HV DUV LEDs
IQE revenue to exceed expectations
'Game-changing' VCSEL system targets clinical imaging
German start-up secures finance for SiC processing tech
Macom signs preliminaries for CHIPS Act funding
IQE and Quintessent partner on QD lasers for AI
EU funds perovskite tandems for fuel-free space propulsion
EU to invest €3m in GeSi quantum project
Transforming the current density of AlN Schottky barrier diodes
Turbocharging the GaN MOSFET with a HfO₂ gate
Wolfspeed launches Gen 4 SiC MOSFET technology
Report predicts high growth for UK's North East
Element Six unveils Cu-diamond composite
SemiQ launches hi-rel 1700V SiC MOSFETs
Lynred to exhibit Eyesential SWIR sensor for machine vision
Thorlabs buys VCSEL firm Praevium Research
Advancing tuneable InP lasers on a heterogeneous platform
P-GaN gate HEMTs have record threshold voltage
Guerrilla RF releases GaN power amplifier dice
Narrow-linewidth DFB lasers now at 405 and 488nm
Researchers develop tech for future fast-charging stations
Vermont GaN Tech Hub awarded nearly $24M
Onsemi completes buy-out of Qorvo SiC JFET business
Quantum Science announces Innovate UK funding
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: