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Indium Precision Au-Based Die-Attach Preforms at SPIE Photonics West

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Indium Corporation® will feature its high-reliability, Au-based precision die-attach (PDA) preforms for critical laser and RF applications at SPIE Photonics West, Jan. 28-Feb. 3, San Francisco, Calif., US.

Indium Corporation is a solder supplier for laser and optical applications. Au-based alloys are a great choice to ensure the best performance and reliability possible for applications requiring a high-melting die-attach solder. In addition to meeting the demanding thermal and electrical requirements for high-reliability applications, they also provide the strongest corrosion- and oxidation-resistant solder joint possible.

Semiconductor laser die-attach applications require the highest quality, ultra-precise solder preforms to ensure accuracy and repeatability during assembly for a guaranteed highly reliable end product. Indium Corporation’s Au-based PDA preforms offer the highest level of quality available to deliver the best performance possible in critical, high-reliability die-attach applications. Features include:

  • Highly accurate thickness control
  • Precision edge quality, virtually burr-free
  • Optimized cleanliness control
  • Default waffle-pack method

Indium Corporation’s Au PDA preforms are available in the following alloys:

  • 80Au/20Sn, 79Au/21Sn, 78Au/22Sn, 75Au/25Sn
  • 88Au/12Ge
  • 82Au/18In
  • 96.8Au/3.2Si

Indium Corporation’s AuLTRA™ 75 is an off-eutectic AuSn preform solution (75Au/25Sn) designed to improve intermetallic reliability in applications using a die with a thicker gold plating, such as a GaN die used for high-frequency, high-power RF power amplifier devices for 5G and other critical military and aerospace wireless communications. AuLTRA 75 helps improve the operation of these critical technologies by adjusting the final solder joint composition and improving wetting and voiding. The AuLTRA™ product line also comes in 78Au/22Sn and 79Au/21Sn compositions.

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