+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
Listen to this article
News Article

Ams Osram qualifies Aixtron tools for Micro LEDs


AIX G5+ C and G10-AsP MOCVD systems now qualified on 200mm wafers for a Micro LED application

Aixtron has announced that Ams Osram has qualified the Aixtron AIX G5+ C and G10-AsP MOCVD systems on 200mm wafers for a Micro LED application.

The MOCVD systems AIX G5+ C and the new G10-AsP from Aixtron SE offer Aixtron planetary technology which is said to be paving the pathway for the next generation of high-resolution Micro LED displays.

In spring 2022, Ams Osram had announced plans to create additional manufacturing capacity in 200mm for the production of LED and Micro LED at its existing location in Malaysia. The MOCVD systems are expected to help enable volume production of Micro LED for a new generation of display applications.

“Aixtron and Ams Osram have a long-standing cooperation, and we are familiar with the performance and quality standards of the equipment. For an ambitious project like the development and production of Micro LED for AsP and GaN devices, we needed exactly such a partner at our side”, says Robert Feurle, executive VP and head of Business Unit Opto Semiconductors at Ams Osram.

Felix Grawert, CEO and president of Aixtron SE, adds: “The G10-AsP and AIX G5+ C qualification at Ams Osram is a very important milestone in our company’s history. Ams Osram is a world-class LED manufacturer and perfectly positioned to enable the fundamental new technology that will come to market. We are on the verge of a technology shift away from conventional display technologies to a new type of Micro LED displays. Now, Aixtron is entering one of the future’s growths markets that has an enormous potential, and we are doing this with a perfect partner at our side.”

The production of Micro LED comes with special requirements, including a special transfer process where multiple thousands of LED chips (arrays) are picked up and transferred. Any defect can result in dead pixels that can make an entire array useless. Hence, an almost error-free epitaxy process is necessary, minimising defects and allowing for high yield and economically viable production of Micro LED.

Aixtron’s new G10-AsP epitaxy tool has been designed to address the specific needs of this application: It is a fully automated AsP reactor offering cassette-to-cassette wafer loading as well as a cleaning mechanism based on in-situ etching. Together, these two features have a major impact on the yield performance, says the company.

Search the news archive

To close this popup you can press escape or click the close icon.
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.

Please subscribe me to:


You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: