Loading...
News Article

Infineon teams with Infinitum on lightweight motor

News

Infineon to provide CoolSiC MOSFETs and other semiconductors in new technology collaboration

Infineon Technologies AG is joining forces with Infinitum, creator of the air core motor. In this technology collaboration, Infineon will provide SiC CoolSiC MOSFETs and other key semiconductor components.

The Infinitum Aircore EC motor uses a patented air-core motor design, which replaces heavy iron used in traditional motors with a lightweight, printed circuit board (PCB). The company’s motors are 50 percent smaller and lighter, ten percent more efficient and use 66 percent less copper than traditional motors.

“Infineon is a leading provider of SiC chips and embedded technologies that can greatly contribute to Infinitum motor system’s value-added features from an energy, carbon footprint and performance standpoint,” said Rick Tewell, president of Infinitum.

Michael Williams, director of product marketing, Industrial Power Control Division, Infineon Technologies said: “We are excited to team with Infinitum, a company that delivers award-winning motor control systems with hardware motor design that has been taken to a whole new level. With our proven SiC and semiconductor technologies, we are helping Infinitum deliver more precise motor control for better power and energy savings.”

Infineon will be showing the Aircore EC motor along with its portfolio of silicon and wide bandgap materials at APEC 2023 in Orlando, Florida, 19 to 23 March.

QD company Quantum Science expands into new facility
Innoscience files lawsuit against Infineon
Riber revenues up 5% to €41.2m
Forvia Hella to use CoolSiC for next generation charging
Photon Design to exhibit QD simulation tool
Ortel transfers CW laser fabrication to Canada
Luminus adds red and blue multi-mode Lasers
PseudolithIC raises $6M for heterogeneous chiplet tech
Mesa sidewall design improves HV DUV LEDs
IQE revenue to exceed expectations
'Game-changing' VCSEL system targets clinical imaging
German start-up secures finance for SiC processing tech
Macom signs preliminaries for CHIPS Act funding
IQE and Quintessent partner on QD lasers for AI
EU funds perovskite tandems for fuel-free space propulsion
EU to invest €3m in GeSi quantum project
Transforming the current density of AlN Schottky barrier diodes
Turbocharging the GaN MOSFET with a HfO₂ gate
Wolfspeed launches Gen 4 SiC MOSFET technology
Report predicts high growth for UK's North East
Element Six unveils Cu-diamond composite
SemiQ launches hi-rel 1700V SiC MOSFETs
Lynred to exhibit Eyesential SWIR sensor for machine vision
Thorlabs buys VCSEL firm Praevium Research
Advancing tuneable InP lasers on a heterogeneous platform
P-GaN gate HEMTs have record threshold voltage
Guerrilla RF releases GaN power amplifier dice
Narrow-linewidth DFB lasers now at 405 and 488nm
Researchers develop tech for future fast-charging stations
Vermont GaN Tech Hub awarded nearly $24M
Onsemi completes buy-out of Qorvo SiC JFET business
Quantum Science announces Innovate UK funding
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: