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ACM receives first order for new SiC cleaning tool


Ultra C SiC substrate cleaning tool ordered by Chinese firm

ACM Research, a supplier of wafer processing solutions, has received its first purchase order (PO) for its Ultra C SiC substrate cleaning tool.

The PO was received from a Chinese SiC substrate manufacturer and is expected to ship before the end of the third quarter of 2023.

ACM’s Ultra C SiC substrate cleaning tool uses SC1 (ammonia/hydrogen peroxide), SC2 (hydrochloric acid/hydrogen peroxide), DHF and other chemicals for the cleaning process, and can also be equipped with ACM’s proprietary Smart Megasonix to achieve better cleaning performance. The tool is 6- and 8-inch compatible and is designed to achieve throughput of more than 70 wafers per hour. The tool has been optimised for handling fragile SiC substrates to minimise breakage.

“The power semiconductor market is experiencing strong growth, with the electric vehicle market and related infrastructure seeing rapidly accelerating deployments,” said David Wang, founder and CEO of ACM. “This order represents the successful application of ACM’s experience in advanced semiconductor wafer processing equipment to meet the unique requirements of SiC substrate manufacturing. We remain committed to expanding our product portfolio to support additional market opportunities.”

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