Loading...
News Article

Vitesco and Rohm sign SiC supply partnership

News

Total project volume of over one billion US dollars between 2024 and 2030 expected

German drives manufacturer Vitesco Technologies has secured strategically important capacities in SiC power semiconductors through a long-term supply partnership with Rohm – worth over one billion US dollars until 2030.

The development partnership with Rohm, which began in 2020, created the basis for the supply partnership now signed in Regensburg, Germany. Vitesco's inverters with integrated Rohm SiC chips will be adopted by two customers, to be applied inside electric vehicle powertrains. Vitesco will start supplying a first series project as early as 2024. The company is thus even ahead of the originally targeted timeline.

"The supply partnership agreement with Rohm is an important building block for securing Vitesco Technologies' SiC capacities in the years ahead," said Andreas Wolf (pictured right), CEO of Vitesco Technologies, at the signing ceremony in Regensburg. "We have had very good experience in our development cooperation so far and are now looking forward not only to continuing it, but also to intensifying it further," adds Wolf.

"In the high-growth automotive market, SiC is a pathfinder for higher efficiency. With an expected higher market share of more than 30 percent, we are strongly positioned here and have gained a strategic partner in Vitesco Technologies for further market penetration," said Kazuhide Ino (pictured left), managing executive officer and CFO of Rohm. at the signing ceremony.

QD company Quantum Science expands into new facility
Innoscience files lawsuit against Infineon
Riber revenues up 5% to €41.2m
Forvia Hella to use CoolSiC for next generation charging
Photon Design to exhibit QD simulation tool
Ortel transfers CW laser fabrication to Canada
Luminus adds red and blue multi-mode Lasers
PseudolithIC raises $6M for heterogeneous chiplet tech
Mesa sidewall design improves HV DUV LEDs
IQE revenue to exceed expectations
'Game-changing' VCSEL system targets clinical imaging
German start-up secures finance for SiC processing tech
Macom signs preliminaries for CHIPS Act funding
IQE and Quintessent partner on QD lasers for AI
EU funds perovskite tandems for fuel-free space propulsion
EU to invest €3m in GeSi quantum project
Transforming the current density of AlN Schottky barrier diodes
Turbocharging the GaN MOSFET with a HfO₂ gate
Wolfspeed launches Gen 4 SiC MOSFET technology
Report predicts high growth for UK's North East
Element Six unveils Cu-diamond composite
SemiQ launches hi-rel 1700V SiC MOSFETs
Lynred to exhibit Eyesential SWIR sensor for machine vision
Thorlabs buys VCSEL firm Praevium Research
Advancing tuneable InP lasers on a heterogeneous platform
P-GaN gate HEMTs have record threshold voltage
Guerrilla RF releases GaN power amplifier dice
Narrow-linewidth DFB lasers now at 405 and 488nm
Researchers develop tech for future fast-charging stations
Vermont GaN Tech Hub awarded nearly $24M
Onsemi completes buy-out of Qorvo SiC JFET business
Quantum Science announces Innovate UK funding
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: