Sivers receives $375k DARPA award
PseudolithIC and Sivers to investigate 3D heterogeneous integration for mmWave applications
Sivers Semiconductors AB's US subsidiary has received a $375,000 award under the Defense Advanced Research Projects Agency (DARPA) Next-Generation Microelectronics Manufacturing (NGMM) program in collaboration with PseudolithIC Inc.
The program aims to develop 3D heterogeneously integrated (3DHI) technologies. PseudolithIC Inc. and Sivers Semiconductors Inc will specifically investigate the heterogeneous integration of Sivers’ RF SOI beamformers with III-V front ends for mmWave 5G, SATCOM and defence applications.
The DARPA Next-Generation Microelectronics Manufacturing (NGMM) program aims to advance the next major wave in microelectronics manufacturing,, which involves the heterogeneous integration of disparate materials and components, enabled by 3D packaging. The DARPA NGMM program is a complementary effort to the US CHIPS ACT, a $52.7B program designed to invigorate American semiconductor research, development, manufacturing, and workforce development.
“One of our major goals with the acquisition of MixComm (today part of Sivers Wireless), was to get a better footprint in the US market. I cannot see any better acknowledgment than getting this award from the DARPA NGMM program. Working in this project on the next generation mmWave applications in the 5G, SATCOM and for the defense sectors is a fantastic step for Sivers,” says Anders Storm, group CEO, Sivers Semiconductors.
Dan Green, PseudolithIC CEO, said: “PseudolithIC is thrilled to partner with Sivers in support of DARPA’s NGMM program. We are excited to team PseudolithIC’s innovative heterogeneous integration technology with the proven performance of Sivers RF SOI beamforming chipsets. This combination of silicon and III-V technology will enable access to the millimeter-wave spectrum with performance and scale surpassing any single, monolithic technology."
Sivers expects all of this revenue to be recognised in 2023.
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