ST announces dual-inline SiC power modules
ACEPACK 1DMT-32 family offers versatile package configurations for automotive applications
STMicroelectronics has released the ACEPACK 1DMT-32 family of SiC power modules in a convenient 32-pin, dual-inline, moulded, through-hole package for automotive applications.
Targeted at systems such as on-board chargers (OBC), DC/DC converters, fluid pumps and air conditioning, they deliver advantages including high power density, very compact design, and simplified assembly. The product family enhances flexibility for system designers by presenting a choice of four-pack, six-pack, and totem-pole configurations.
The modules contain 1200V SiC power switches that leverage ST’s state-of-the-art, second- and third-generation SiC MOSFET technology ensuring low RDS(on) values. The devices deliver efficient switching performance with minimal dependence on temperature to ensure high efficiency and reliability at converter system level.
Based on ST’s ACEPACK technology, the modules are said to reduce overall system- and design-development costs while ensuring high reliability. The package technology features an aluminum nitride (AlN) insulated substrate for excellent thermal performance. There is also an integrated NTC sensor that provides temperature monitoring for thermal protection.
The first product in ACEPACK DMT-32, introduced now with, volume production planned for Q4’23, is M1F45M12W2-1LA. The M1F80M12W2-1LA, M1TP80M12W2-2LA, M1P45M12W2-1LA, M1P80M12W2-1LA, M1P30M12W3-1LA are sampling now with ramp-up to volume production starting from Q1’24. Pricing is dependent on configuration.