Loading...
News Article

Laser Thermal appoints Angstrom Scientific

News

Angstrom will address the growing demand for thermal metrology solutions

Laser Thermal, a provider of thermal property measurement tools, has signed Angstrom Scientific as its newest representative for sales of the company’s SSTR-F (Steady State Thermoreflectance in Fibre) thermal conductivity and thermal resistance measurement tool.

Angstrom will address the growing demand for thermal metrology solutions. In addition, the company will also support the sales of Laser Thermal’s contract testing services business.

Under the terms of the agreement, Angstrom Scientific will represent Laser Thermal and its products and services throughout the United States, with a primary focus on serving the semiconductor and materials research industries.

Founded in 2020, Laser Thermal began as a spinoff from the University of Virginia. It focuses on providing accessible thermal measurements of materials primarily focusing on thin films.

Ascent wins order for power beaming Space PV module
Navitas Partners with Great Wall for 400V-DC power
SemiQ supplies SiC MOSFET modules for EV battery cell cyclers
Coherent and Keysight collaborate on 200G/lane multimode VCSEL tech
Lumentum and Marvell exhibit integrated 450G optical interface
Marktech announces new MWIR LEDS
Imec identifies stable range for GaN MISHEMTs in RF PAs
Polar Light completes $3.4m funding round
Lynred launches advanced thermal imaging modules
Altum RF expands Sydney design centre
Sivers announces partnership with O-Net
Ayar Labs unveils first UCIe optical chiplet
Aixtron delivers InP tool to Nokia
WHU-USTC team demo novel temperature monitoring of GaN device
Phlux lands £9m to take InGaAs sensors to next level
4-inch gallium oxide facility established in Swansea
Mazda and Rohm collaborate on automotive GaN
University of South Carolina chooses MOCVD tool from TNSC
Wolfspeed appoints new CEO amidst funding crisis
SiC slowdown is only short term, says Yole
Pragmatic launches flexible IGZO-based NFC chip
Poet ships latest optical engine samples
EU project to develop 1200V DC powertrain
£250m to turbocharge Welsh compound semi cluster
Scientists harness phonon-polariton electroluminescence
TU Graz team reveals the secrets of heat conduction
Aixtron to partner in ‘GraFunkL‘ UVC project
EU collaboration steps up heterogeneous design
Diodes Inc announces InSb sensors
Far-UVC module targets close-quarters disinfection
Sivers and WIN collaborate on DFB laser production
Boosting the blocking voltage of birectional HEMTs
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: