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Wednesday 13th July 2011
The BCP-Series gallium arsenide based devices up to 26 GHz, are immediately available. The series also includes devices for wideband (6-18 GHz) or narrowband RF applications.
Wednesday 13th July 2011
The firm has taken on Vincent Pelliccia, who has 25 years of experience in the industry, as Senior Director Asia Pacific Sales.
Tuesday 12th July 2011
The firm has recently expanded its portfolio of LED manufacturing systems and applications whilst delivering the lowest cost of ownership.
Tuesday 12th July 2011
The academic institution has purchased an Oxford Instruments plasma etch tool which will be used for a number of applications including optoelectronics, mm-wave & terahertz, lab-on-a-chip and photovoltaics research.
Tuesday 12th July 2011
The implant-free quantum-well (IF-QW) devices with a buried SiGe channel have good electrostatic gate control and a low variability of key electrical parameters, significantly improving device performance.
Tuesday 12th July 2011
The highly automated “c-axis” growth furnaces are used to produce sapphire boules, and significantly drive down the cost of producing LEDs.
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Tuesday 12th July 2011
The new models achieving better cost of ownership by further enhancing productivity and yield for high-volume manufacturing of III-nitride HB LED chips.
Tuesday 12th July 2011
Conventional GaN HEMTs are excellent devices over a wide frequency range. However, for great performance at really high speeds, it's best to switch from the standard gallium face to a nitrogen one, according to UCSB's Umesh Mishra.
Tuesday 12th July 2011
Graham Legett has previously worked for AEA Technology and NPL and will use his gas analysis expertise to address the critical needs to measure and curb emissions.
Tuesday 12th July 2011
RSL hopes to commercialise its indium gallium nitride-on-silicon technology in the next 2-3 years and then develop it further for growth on 200mm silicon substrates.
Tuesday 12th July 2011
IMA ‘s 'modu*contec' system combines all production steps and tools needed for CIGS and CdTe thin film photovoltaics in one versatile system whilst ensuring super fast processing.
Tuesday 12th July 2011
The indium phosphide based PIC provider is expanding its sales force to support the company's success in the cable and key vertical markets.
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Tuesday 12th July 2011
The strategic financing round is focussed on expanding Daylight’s core compound semiconductor QCL technology and manufacturing infrastructure for defence and commercial applications.
Tuesday 12th July 2011
The pioneering partnership between the University of Albany NanoCollege and SEMATECH will lead a national push to accelerate solar energy research, development and manufacturing in CIGS technology.
Monday 11th July 2011
Soh will initially be concentrating on mobile communications, in which he has broad industry experience, having worked for Motorola, Delphi and Fujitsu Microelectronics.
Monday 11th July 2011
The NYSERDA award will help accelerate the firm’s growth and help ensure that it can meet increasing demands.
Monday 11th July 2011
Cree is now focusing on general LED lighting applications while Veeco is also concentrating much of its efforts on LED manufacturing equipment after its profit more than doubled in the last quarter.
Monday 11th July 2011
The 3Sun factory, which manufactures solar panels based on triple junction compound semiconductor technology, will initially have the capacity to produce PV modules to provide 160 MW per year.
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Monday 11th July 2011
The firm’s latest bulk specialty gas source systems, which can be used in compound semiconductor manufacturing, provide flow rates of up to 1,000 slpm.
Monday 11th July 2011
The purchase of the supplier of professional lighting applications opens up new growth potential for LED applications. Osram has also appointed Klaus-Günter Vennemann as head of the business unit Professional Lighting.
Monday 11th July 2011
The pollution control equipment manufacturer is teaming up with the vacuum equipment and service provider to offer complete, turnkey vacuum and abatement solutions for the compound semiconductor, LED and solar industries.
Monday 11th July 2011
The European Space Agency (ESA) camera to be used for the mission to map one thousand million stars, uses high temperature resistant silicon carbide as the CCD support structure.
Monday 11th July 2011
Material handling solutions and products designed to achieve target cell efficiencies and productivity in CIGS and CdTe thin film processes have been developed by Entegris.
Monday 11th July 2011
The Korean LED chip manufacturer and research institute will collaborate to become more competitive in the LED market

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