Loading...
News Article

Mission announces Highly Integrated GaN BUCs

News

Flatpack and Cube solid state block upconverters target new applications for multiple antenna configurations

Mission Microwave Technologies, a US manufacturer of solid state power amplifiers (SSPAs) and block up converters (BUCs) has announced general availability of compact GaN-based BUCs in Ku and Ka bands for use in lightweight and embedded platforms.

The 1inch thick Flatpack BUCs are available in 12 W Ka Band and 25 W Ku band versions. They are self-contained with forced air cooling, a full monitor and control Interface, and suitable for rugged environments with an IP-67 rating, according to the company.

The Ku Band Cube is a ruggedised 25 W BUC with a full suite of monitor and control functions available in serial or Ethernet formats. It draws less than 80 Watts of DC power to produce 16 W of linear power.

The Cube BUC is already deployed on customer terminals and will be on exhibit integrated into small antenna offerings from multiple vendors at Satellite 2018 in Washington, DC on March 13 -15 and also at Convergence India on March 7 -9 in New Delhi, India.

Double heterostructure HEMTs for handsets
AlixLabs to collaborate with Linköping University
SiC MOSFETs: Understanding the benefits of plasma nitridation
Wolfspeed reports Q2 results
VueReal secures $40.5m to scale MicroSolid printing
Mitsubishi joins Horizon Europe's FLAGCHIP project
Vishay launches new high voltage SiC diodes
UK team leads diamond-FET breakthrough
GaN adoption at tipping point, says Infineon
BluGlass files tuneable GaN laser patents
QD company Quantum Science expands into new facility
Innoscience files lawsuit against Infineon
Riber revenues up 5% to €41.2m
Forvia Hella to use CoolSiC for next generation charging
Photon Design to exhibit QD simulation tool
Ortel transfers CW laser fabrication to Canada
Luminus adds red and blue multi-mode Lasers
PseudolithIC raises $6M for heterogeneous chiplet tech
Mesa sidewall design improves HV DUV LEDs
IQE revenue to exceed expectations
'Game-changing' VCSEL system targets clinical imaging
German start-up secures finance for SiC processing tech
Macom signs preliminaries for CHIPS Act funding
IQE and Quintessent partner on QD lasers for AI
EU funds perovskite tandems for fuel-free space propulsion
EU to invest €3m in GeSi quantum project
Transforming the current density of AlN Schottky barrier diodes
Turbocharging the GaN MOSFET with a HfO₂ gate
Wolfspeed launches Gen 4 SiC MOSFET technology
Report predicts high growth for UK's North East
Element Six unveils Cu-diamond composite
SemiQ launches hi-rel 1700V SiC MOSFETs
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: