Plasma-Therm acquires Kobus
Acquisition expands the plasma-based deposition and etch suite of products for silicon and emerging compound semiconductor applications
Plasma-Therm has acquired Kobus, a French plasma deposition company, which has developed an alternative to ALD technology for use where thick and conformal films are required.
Kobus' FAST (Fast Atomic Sequential Technology) is a deposition method that is described as being on the 'crossroads' of ALD and CVD.
The proprietary CVD reactor design has pulsing capability and while capable of depositing in traditional ALD mode, it is most suited to thick and conformal layer deposition and offers new solutions for 3D integration challenges.
According to Plasma-Therm, Kobus as a company offers a unique portfolio of equipment for both mature and advanced materials deposition, which merges well with Plasma-Therm's operation, expanding the plasma-based deposition and etch suite of products for all silicon and compound semiconductor emerging applications.
This acquisition will allow Plasma-Therm to establish a solid base in Europe and conduct R&D development in the Grenoble 'Silicon Valley' a region fuel;ed with R&D, startups and large semiconductor corporations.