StratEdge to show GaN and GaAs Packages
CS ManTech and IMAPS HiTEC Conferences to feature latest packaging technology for high-temperature applications
StratEdge, a maker of high-performance semiconductor packages for microwave, millimeter-wave, and high-speed digital devices, will be exhibiting the latest packaging technology for high-temperature applications including GaAs and GaN devices at both the IMAPS HiTEC Electronics in Albuquerque, New Mexico on May 8 and 9th and CS ManTech conferences the week of May 7, 2018.
"StratEdge packages have been popular for their heat dissipating properties and high-reliability for over 20 years," explained Tim Going, president of StratEdge, "but with a continued emphasis on lowering power and pushing the capabilities of chips to deliver ever-higher frequencies, these packages are truly critical. Attending these shows enables us to work with engineers to build packages that enable proper functioning of their chips."
