Loading...
News Article

Leti and Soitec announce substrate collaboration

News
World-class prototyping hub will feature access to shared Leti-Soitec expertise around a focused pilot line

Leti, a research institute of CEA Tech, and Soitec, a designer and manufacturer of innovative semiconductor materials, have announced a new collaboration and five-year partnership to drive the R&D of advanced engineered substrates, including SOI and beyond.

This agreement brings the traditional Leti-Soitec partnership to a new dimension and includes the launch of a world-class prototyping hub associating equipment partners to pioneer with new materials, The Substrate Innovation Centre will feature access to shared Leti-Soitec expertise around a focused pilot line. Key benefits for partners include access to early exploratory sampling and prototyping, collaborative analysis, and early learning at the substrate level, eventually leading to streamlined product viability and roadmap planning at the system level.

Chip makers and foundries worldwide use Soitec products to manufacture chips for consumer applications targeting performance, connectivity, and efficiency with extremely low energy consumption. Applications include smart phones, data centres, automotive, imagers, and medical and industrial equipment, but this list is always growing, along with the need for flexibility to explore new applications starting at the substrate level.

At the Substrate Innovation Centre, located on Leti's campus in Grenoble, France, Leti and Soitec engineers will explore and develop innovative substrate features, expanding to new fields and applications with a special focus on 4G/5G connectivity, artificial intelligence, sensors and display, automotive, photonics, and edge computing.

"¨"Material innovation and substrate engineering make entire new horizons possible. The Substrate Innovation Centre will unleash the power of substrate R&D collaboration beyond the typical product road maps, beyond the typical constraints," said Paul Boudre, Soitec CEO."The Substrate Innovation Centre is a one-of-a-kind opportunity open to all industry partners within the semiconductor value chain.""¨ "¨

Whereas a typical manufacturing facility has limited flexibility to try new solutions and cannot afford to take risks with prototyping, the mission of the Substrate Innovation Centre is to become the world's preferred hub for evaluating and designing engineered substrate solutions to address the future needs of the industry, inclusive of all the key players, from compound suppliers to product designers.

Using state of the art, quality-controlled clean room facilities, and the latest industry-grade equipment and materials, Leti and Soitec engineers will conduct testing and evaluation at all levels of advanced substrate R&D. "¨"Leti and Soitec's collaboration on SOI and differentiated materials, which extends back to Soitec's launch in 1992, has produced innovative technologies that are vital to a wide range of consumer and industrial products and components," said Emmanuel Sabonnadière, Leti CEO. "This new common hub at Leti's campus marks the next step in this ongoing partnership. By jointly working with foundries, fabless, and system companies, we provide our partners with a strong edge for their future products."

Double heterostructure HEMTs for handsets
AlixLabs to collaborate with Linköping University
SiC MOSFETs: Understanding the benefits of plasma nitridation
Wolfspeed reports Q2 results
VueReal secures $40.5m to scale MicroSolid printing
Mitsubishi joins Horizon Europe's FLAGCHIP project
Vishay launches new high voltage SiC diodes
UK team leads diamond-FET breakthrough
GaN adoption at tipping point, says Infineon
BluGlass files tuneable GaN laser patents
QD company Quantum Science expands into new facility
Innoscience files lawsuit against Infineon
Riber revenues up 5% to €41.2m
Forvia Hella to use CoolSiC for next generation charging
Photon Design to exhibit QD simulation tool
Ortel transfers CW laser fabrication to Canada
Luminus adds red and blue multi-mode Lasers
PseudolithIC raises $6M for heterogeneous chiplet tech
Mesa sidewall design improves HV DUV LEDs
IQE revenue to exceed expectations
'Game-changing' VCSEL system targets clinical imaging
German start-up secures finance for SiC processing tech
Macom signs preliminaries for CHIPS Act funding
IQE and Quintessent partner on QD lasers for AI
EU funds perovskite tandems for fuel-free space propulsion
EU to invest €3m in GeSi quantum project
Transforming the current density of AlN Schottky barrier diodes
Turbocharging the GaN MOSFET with a HfO₂ gate
Wolfspeed launches Gen 4 SiC MOSFET technology
Report predicts high growth for UK's North East
Element Six unveils Cu-diamond composite
SemiQ launches hi-rel 1700V SiC MOSFETs
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: