Loading...
News Article

Sino-Semiconductor buys Aixtron tool for VCSEL production

News
New Chinese customer orders first AIX 2800G4-TM MOCVD system

Aixtron, a deposition equipment company, has announced that Chinese chipmaker Sino-Semiconductor has ordered an AIX 2800G4-TM MOCVD system for the production of laser diodes.The tool will be delivered in the course of Q4/2018.

Sino-Semiconductor's main products include 10G, 25G datacom VCSEL chips and 0.1mW-4W sensor VCSEL chips. They are mainly used in optical communication, mobile & non-mobile facial recognition modules, autonomous vehicles, LIDAR, security monitoring, laser TV, laser display, laser lighting and other fields.

Ling Yong Peng, general manager of Sino-Semiconductor commented: "In recent years the AIX 2800G4-TM platform has already succeeded in the market for the production of VCSELs or datacom lasers. This is the first time we order an MOCVD system from Aixtron and we are very much looking forward to benefit from the excellent performance of the AIX 2800G4-TM platform in terms of wafer homogeneity and maximum flexibility."

"We are very pleased to have convinced Sino-Semiconductor of the performance of our AIX 2800G4-TM system. It is the ideal solution for high-volume production in the field of photonic applications. Looking forward to our new cooperation, we will support Sino-Semiconductor in the best possible adaption of their production processes to our equipment technology," says Bernd Schulte, president of Aixtron SE.

Double heterostructure HEMTs for handsets
AlixLabs to collaborate with Linköping University
SiC MOSFETs: Understanding the benefits of plasma nitridation
Wolfspeed reports Q2 results
VueReal secures $40.5m to scale MicroSolid printing
Mitsubishi joins Horizon Europe's FLAGCHIP project
Vishay launches new high voltage SiC diodes
UK team leads diamond-FET breakthrough
GaN adoption at tipping point, says Infineon
BluGlass files tuneable GaN laser patents
QD company Quantum Science expands into new facility
Innoscience files lawsuit against Infineon
Riber revenues up 5% to €41.2m
Forvia Hella to use CoolSiC for next generation charging
Photon Design to exhibit QD simulation tool
Ortel transfers CW laser fabrication to Canada
Luminus adds red and blue multi-mode Lasers
PseudolithIC raises $6M for heterogeneous chiplet tech
Mesa sidewall design improves HV DUV LEDs
IQE revenue to exceed expectations
'Game-changing' VCSEL system targets clinical imaging
German start-up secures finance for SiC processing tech
Macom signs preliminaries for CHIPS Act funding
IQE and Quintessent partner on QD lasers for AI
EU funds perovskite tandems for fuel-free space propulsion
EU to invest €3m in GeSi quantum project
Transforming the current density of AlN Schottky barrier diodes
Turbocharging the GaN MOSFET with a HfO₂ gate
Wolfspeed launches Gen 4 SiC MOSFET technology
Report predicts high growth for UK's North East
Element Six unveils Cu-diamond composite
SemiQ launches hi-rel 1700V SiC MOSFETs
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
x
Adblocker Detected
Please consider unblocking adverts on this website