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DISCO Announces 8inch Wafer Grinder

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New automatic grinder is suited to silicon, LiTaO3, LiNbO3, and SiC wafers

DISCO Corporation has announced a new fully automatic grinder compatible with 8-inch wafers and able to grind a wide variety of materials, including silicon, LiTaO3, LiNbO3, and SiC. Called the DFG8640, it will be exhibited at SEMICON Japan 2018 (held at Tokyo Big Sight from December 12 to 14.)

The gap between target thickness and actual thickness, as well as wafer thickness variation after grinding, may affect the characteristics of products such as power devices and some sensors. Thus, a grinder capable of high precision processing is necessary.

The demand for SAW devices, which are used in mobile communication devices including smartphones, continues to expand. LT and LN, which are the materials for those devices, are difficult to grind, and high precision processing is required.

According to DISCO, the DFG8640 fulfils these needs and achieves a small footprint and productivity improvements.

Features include high precision grinding; optimising the processing point layout reduces thickness variation for both individual wafers and between wafers; a new spindle with high rigidity, low vibration, and less rotation speed fluctuation. A new graphical user interface achieves more intuitive operation such as swiping.



CS International 26-27 March 2019, Sheraton Airport Hotel, Brussels

In its ninth year, CS International will continue to provide timely, comprehensive coverage of every important sector within the compound semiconductor industry. Presentations are split into 5 key themes and each industry key theme will be delivered by a keynote presentation from a leading industry figure as well as a market analyst presentation tailored to the theme. Together, the talks will detail breakthroughs in device technology; offer insights into the current status and the evolution of compound semiconductor devices; and provide details of advances in tools and processes that will help to drive up fab yields and throughputs. Attendees at the two-day conference will gain an up-to-date overview of the status of the CS industry, and have opportunities to meet many other key players within this community.

Places will be limited, so register your place today: https://cs-international.net

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