Loading...
News Article

Indichip Semis to build $1.4b SiC fab

News
India's 'first private semiconductor manufacturing facility' will have potential for 50,000 wafers per month

India's Indichip Semiconductors has signed an agreement with the government of Andhra Pradesh to construct what is described as 'India's first private semiconductor manufacturing facility'.

The proposed SiC fab will launch with a production capacity of 10,000 wafers per month, rising to 50,000 wafers per month within two to three years. According to the company's website, it will start with 6-inch SiC wafers, and then transition to 8-inch SiC wafers.

The agreement was brokered by the government of Andhra Pradesh, along with representatives of Indichip and its Japanese partner Yitoa Micro Technology (formerly Pioneer Micro Technology).

.

Indichip Semis to build $1.4b SiC fab
Printing high-speed modulators on SOI
Sivers signs CHIPS Act contracts
Photon IP raises €4.75m for advanced PICs
Imec makes breakthrough with GaAs lasers on silicon
VueReal appoints VP of semiconductor engineering
Plessey and Meta announce brightest red microLED display
Laser Thermal wins contract from Louisiana Tech University
Riber gets repeat US order for MBE 412 cluster
Na‑flux method improves GaN device performance
X-Rite introduces booth for LED-based colour evaluation
Quantum Science signs QD technology deal
Penn State makes breakthrough in photonic switching
Rohm develops 1kW class IR laser diode
US ITC says Innoscience infringed EPC GaN patent
Aledia's microLED line is ready to roll
China adds more US firms to export control List
Imec shows outdoor stability of perovskite modules
Chiplets set to transform electronics, says IDTechEx
Riber secures production system order in Europe
FBH to present novel lasers at Photonics West
US DOE awards $179m for fundamental chip research
Polar Light Tech makes microLED breakthrough
Precursor modulation enhances DUV LED efficiency
US Government to probe Chinese chip trade practices
EPC Space achieves JANS MIL-PRF-19500 certification
HKUST team develops DUV microLED chips for lithography
Porotech partners with Foxconn on microLEDs
Scientists make laser-based artificial neuron
NS Nanotech shows benefit of far-UVC in ambulances
Power Integrations' switcher targets 800V applications
PlayNitride selects Veeco MOCVD system
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: