Loading...
News Article

Aledia's microLED line is ready to roll

News
French firm says 3D GaN-on-silicon nanowire tech is set to pave the way for the most immersive AR experience to date

At CES 2025, French microLED display firm Aledia has announced that its $200m state-of-the-art microLED production line in Grenoble is ready to support customer demand ramp-up to nearly 5,000 wafer starts per week..

After 12 years of research, a portfolio of nearly 300 patents and $600 million in investment, Aledia believes its microLED-based microdisplay – with Red, Green and Blue microLEDs on the same substrate - can solve the toughest hardware challenges for AR, paving the way for the most immersive, AI-powered AR vision experiences to date.

The 3D GaN-on-silicon nanowire technology is said to offer higher brightness and better energy efficiency than 2D LEDs, with the 3D structure allowing for precise and directive light emission, suiting it to applications like AR.

“Immersive technologies such as AR haven’t reached their full potential as the industry has yet to design screens that are both slick and highly functional,” said Pierre Laboisse, president and CEO of Aledia. “At Aledia, we’ve created a nanowire technology that makes microLED displays thinner, more power efficient and easier to produce for mass adoption. By next CES, OLED and LCOS will already be phased out in favour of our superior microLED technology.”

“Our Champagnier factory is a key milestone for European innovation, and we are proud to represent it at the Auvergne Rhône-Alpes Pavilion at CES,” added Laboisse. “We are redefining global standards of display technology with our efficient and high-performing chips, positioning Grenoble as the global center of microLED production.”

Imec makes breakthrough with GaAs lasers on silicon
VueReal appoints VP of semiconductor engineering
Plessey and Meta announce brightest red microLED display
Laser Thermal wins contract from Louisiana Tech University
Riber gets repeat US order for MBE 412 cluster
Na‑flux method improves GaN device performance
X-Rite introduces booth for LED-based colour evaluation
Quantum Science signs QD technology deal
Penn State makes breakthrough in photonic switching
Rohm develops 1kW class IR laser diode
US ITC says Innoscience infringed EPC GaN patent
Aledia's microLED line is ready to roll
China adds more US firms to export control List
Imec shows outdoor stability of perovskite modules
Chiplets set to transform electronics, says IDTechEx
Riber secures production system order in Europe
FBH to present novel lasers at Photonics West
US DOE awards $179m for fundamental chip research
Polar Light Tech makes microLED breakthrough
Precursor modulation enhances DUV LED efficiency
US Government to probe Chinese chip trade practices
EPC Space achieves JANS MIL-PRF-19500 certification
HKUST team develops DUV microLED chips for lithography
Porotech partners with Foxconn on microLEDs
Scientists make laser-based artificial neuron
NS Nanotech shows benefit of far-UVC in ambulances
Power Integrations' switcher targets 800V applications
PlayNitride selects Veeco MOCVD system
Bosch gets $225m CHIPs funding for US SiC fab
More CHIPS funding for GlobalWafers
VueReal to show microLED design kits at CES
Cree LED and Daktronics sign LED agreement
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: