News Article
CHIPX plans 8-inch GaN-on-SiC fab in Malaysia
Initiative from Dublin-based firm supports Malaysia's National Semiconductor Strategy
Dublin-based CHIPX plans to establish an 8-inch GaN on SiC wafer fabrication facility in Malaysia.
This initiative supports Malaysia's National Semiconductor Strategy and New Industrial Master Plan (NIMP) 2030.
The company says its focus on GaN on SiC enables resilient, high-voltage power ICs and photonics – core technologies for high performance systems in AI data centres, TVs, and aerospace.
Beyond the facility itself, CHIPX will be building a vertically integrated platform, with structured technology transfer, engineering partnerships, and dedicated local talent development.
