Fuji and Robert Bosch collaborate on SiC modules
Fuji Electric has announced an agreement with Robert Bosch GmbH to collaborate on SiC power semiconductor modules for electric vehicles that feature package compatibility.
Fuji Electric's SiC power semiconductor modules for EVs incorporate a unique packaging technology, designed to allow high power density in inverters. By modifying the size and number of mounted chips, the modules can accommodate a wide range of power requirements and circuit configurations from our automotive manufacturer customers.
Moving forward, both companies intend to develop SiC power semiconductor modules with mechanical compatibility in terms of package outer dimensions and terminal positions. This will enable either module to be integrated into an inverter system without additional mechanical modifications, minimising the adjustment effort required for customers when using both module options in their systems.
This collaboration aims to shorten design periods and contribute to diversifying procurement sources. As a result, customers will be able to use SiC power semiconductor modules from both companies without altering their inverter system specifications, leading to reduced design time and diversified procurement.
Both also companies plan to jointly develop user application technologies related to cooler design and various terminal connections when integrating SiC power semiconductor modules into inverter systems, and plan to provide technical support to customers.
