Coherent samples high thermal conductivity 300mm SiC substrates
Photonics firm Coherent has begun sampling of its 300mm high thermal conductivity SiC substrates to AI semiconductor partners for evaluation.
Coherent says its vertically integrated capabilities in SiC crystal growth, wafering, polishing, and characterisation provide control across the production process and support progression toward future high-volume manufacturing.
The high thermal conductivity substrates are engineered to improve heat spreading by up to 25 percent more than current solutions while maintaining compatibility with existing semiconductor manufacturing platforms.
“AI performance is increasingly constrained by the industry’s ability to remove heat from next-generation processors,” said Craig Mullaney, SVP and general manager at Coherent. “Advanced SiC thermal management materials can play an important role in addressing that challenge. By combining decades of silicon carbide expertise with a scalable 300mm manufacturing platform, Coherent is helping build the materials foundation for future AI infrastructure.”
