Coherent launches PhotonLink platform for next gen data centres
Photonics firm Coherent has announced PhotonLink, an integrated optics platform that brings together Coherent’s portfolio of photonics technologies, assembly and test capabilities to deliver complete optical solutions for next-generation AI data centres.
The platform supports co-packaged optics (CPO), near-packaged optics (NPO) and emerging chip to chip connectivity.
“The next leap in AI requires more than faster chips – it requires a new way to connect them,” said Jim Anderson, CEO at Coherent. “Customers need complete optical solutions, not just individual components. Coherent is uniquely positioned to bring together the critical technologies, integrate and test the finished assemblies, and manufacture them at scale. PhotonLink puts that capability to work for the next generation of AI infrastructure.”
The PhotonLink platform spans four functions of the optical path: Generate, Shape, Guide and Receive. The portfolio includes InP lasers, VCSEL arrays, silicon photonics, isolators, specialty fibres, micro-optics and detectors. Coherent integrates these technologies into external laser sources, precision fibre assemblies and optical modules tailored to customer architectures.
Coherent has more than ten CPO customer engagements and more than ten NPO engagements, with anchor customers and long-term agreements secured for both architectures. The company also has more than five engagements in emerging chip to chip connectivity. Revenue from the PhotonLink platform is expected to begin ramping in Q4 of CY2026.
PhotonLink builds on Coherent’s data centre manufacturing base, which has shipped more than 300 million InP lasers and more than one billion InP and GaAs photodetectors. Coherent is expanding its 6 inch InP and specialty fibre manufacturing capacity to support the PhotonLink ramp.
Coherent hosted a PhotonLink launch event on September 21 at the Gran Hotel Miramar in Málaga during the European Conference on Optical Communication (ECOC) 2026.
